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Institution Date Title Author
國立交通大學 2017-04-21T06:49:30Z Investigation of Low Temperature Cu/In Bonding in 3D Integration Hsieh, Yu-Sheng; Shen, Ting-Ting; Chien, Yu-San; Chen, Kuan-Neng; Shinozaki, Yuko; Kawasaki, Naohiko
國立交通大學 2014-12-12T02:42:14Z 三維積體電路技術之銅/銦金屬低溫接合面研究 沈婷婷; Shen, Ting-Ting; 陳冠能; Chen, Kuan-Neng

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