臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
義守大學	2013-02	Finite Element Modeling of SnAgCu Alloy on 3D Package-on-Package (POP) Subjected to Board Level Drop Test	Hsiang-Chen Hsu;Shen-Wen Ju;Shih-Jeh Wu;Miin-Shyan Bair
義守大學	2010-08	Electromigration Analysis and Electro-Thermo-Mechanical Design for Package-on-Package (POP)	Hsiang-Chen Hsu;Shen-Wen Ju;Jie-Rong Lu;Yue-Min Wan
義守大學	2009/10/21	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Shen-Li Fu
義守大學	2009/08/10	Electromigration analysis and electro-thermo-mechanical design for semiconductor package	Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Hong-Shen Chang ; Hong-Hau Wu
義守大學	2009-10	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu; Shen-Wen Ju; Jie-Rong Lu; Shen-Li Fu;

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