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Institution	Date	Title	Author
義守大學	2018-04	Laser Micro-machining of LPM Compound Material for Panel and IC packaging	Wen-Fei Lin;Shih-jeh Wu;Hsiang-Chen Hsu;Boen Houng;Min-Shuo Chen
義守大學	2018-04	Rapid Laser Drilling on Thick Ceramic Substrates for SiP Applications	Shih-jeh Wu;Hsiang-Chen Hsu;Wen-Fei Lin;Boen Houng;Yeh Chang
義守大學	2018-02	A hybrid method of ultrafast laser dicing and high density plasma etching with water soluble mask for thin silicon wafer cutting	Shih-jeh Wu
義守大學	2018-01	Reliability Design and Optimization Process on Through Mold Via Using Ultrafast Laser	Hsiang-Chen Hsu;Shih-Jeh Wu;Wen-Fei Lin;Boen Houng
義守大學	2017-12	利用表面蝕刻消除於雷射藍寶石研磨加工產生之應力	金佩傑;吳士傑; Pei-Chieh Chin;Shih-Jeh Wu
義守大學	2017-04	An investigation on ultrathin wafer dicing by ultrafast laser with high density plasma etching	Shih-jeh Wu;Hsiang-Chen Hsu;Wen-Fei Lin;Shen-Li Fu
義守大學	2017-02	Exploring light extraction efficiency of InGaN LED by creating structured voids in substrate with a femtosecond laser	Shih-jeh Wu;Chun-Lung Tseng;Tsung-Sheng Lu;Ying-Chieh Chen;Pei-Hsiang Tseng
義守大學	2016-12	Glass cutting with elongation optics in comparison to conventional methods by laser	Shih-Jeh Wu;Hsiang-Chen Hsu;Wen-Fei Lin
義守大學	2016-10	Reduction of Residual Stresses in Sapphire Cover Glass Induced by Mechanical Polishing and Laser Chamfering Through Etching	Shih-Jeh Wu;Hsiang-Chen Hsu;Wen-Fei Lin
義守大學	2016-09	An investigation on micro-via drilling on ceramic substrates by a picosecond laser	Hsiang-Chen Hsu;Shih-Jeh Wu
義守大學	2016-04	Through Mold Via (TMV) by gas-aided laser	Hsiang-Chen Hsu;Shih-Jeh Wu;Wen-Fei Lin;Chi-Shiung Hsi;Hsing-Yi Pao;Pin-Chieh Wang
國立高雄師範大學	2015-06-01	超音波脈衝回波法量測硬脆材料特性之探討	金佩傑;吳士傑;劉杰靈; Pei-Chieh Chin;Shih-Jeh Wu;Hawking Liu
義守大學	2015-06	超音波脈衝回波法量測硬脆材料特性之探討	金佩傑;吳士傑;劉杰靈; Pei-Chieh Chin;Shih-Jeh Wu;Hawking Liu
義守大學	2015-04	Internal patterning of the glass backlight module for LCD panel by laser	Shih-Jeh Wu;Hsiang-Chen Hsu;Pin-Chieh Wang;Shen-Li Fu
義守大學	2014-10	An experimental study on dicing 28 nm low-k water using laser grooving technique	Hsiang-Chen Hsu;Cheng-Jiun Han;Li-Ming Chu;Shih-Jeh Wu;Chih-Chiang Fu;Shen-Li Fu;Baojun Liu;Chen-Yi Wang;PoChun Jung
義守大學	2014-10	Cutting PCB with a 532nm DPSS green laser	Hsiang-Chen Hsu;Shih-Jeh Wu;Chih-Chiang Fu;Li-Ming Chu;Shen-Li Fu;Trong-Tai Nguyen
義守大學	2014-09	Novel design and fabrication of a geometrical obstacle-embedded micromixer with notched wall	Shih-Jeh Wu;Hsiang-Chen Hsu;Wen-Jui Feng
義守大學	2014-06	Laser drilling and thermal stress analysis on TSV in 3D IC structure	Hsiang-Chen Hsu;Shih-Jeh Wu
義守大學	2014-03	Numerical simulation of high power LED heat-dissipating system	Shih-Jeh Wu;Hsiang-Chen Hsu;Shen-Li Fu;Jiam-Nan Yeh
義守大學	2013-10	Thermal design for high power arrayed LED heat-dissipating system	Hsiang-Chen Hsu;Shih-Jeh Wu;Jyun-Yi Li;Jing-Wen Su;Jian-Siang Huang;Shen-Li Fu
義守大學	2013-10	Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis	Hsiang-Chen Hsu;Shih-Jeh Wu;Feng-Jui Hsu;Meng-Chieh Weng;Shen-Li Fu
義守大學	2013-02	Finite Element Modeling of SnAgCu Alloy on 3D Package-on-Package (POP) Subjected to Board Level Drop Test	Hsiang-Chen Hsu;Shen-Wen Ju;Shih-Jeh Wu;Miin-Shyan Bair
義守大學	2013-02	Measurements of Residual Stress and Angular Distortion of 7075 Aluminum Alloy after Gas Tungsten Arc Welding	Shih-Jeh Wu;Chiao-Wei Chung;Chen-Ming Kuo
義守大學	2013-02	Application of Pico-Second Laser on Low-K Wafer Dicing	Shih-Jeh Wu;Weike-Vic Chao
義守大學	2013-01	Measurements of Residual Stress and Angular Distortion of 7075 Aluminum Alloy after Gas Tungsten Arc Welding	Shih-Jeh Wu;Chiao-Wei Chung;Chen-Ming Kuo

Showing items 1-25 of 42 (2 Page(s) Totally)
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