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Showing items 1-16 of 16 (1 Page(s) Totally)
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| 國立交通大學 |
2018-08-21T05:54:05Z |
Polymer-Based Liner TSV Fabrication Scheme and Its Resistance Variation
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Lee, Shih-Wei; Shih, Jian-Yu; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:17Z |
Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer Interface
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Hsieh, Yen-Hui; Huang, Yen-Jun; Shih, Jian-Yu; Leu, Jihperng; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:55:30Z |
Adhesion Property Between Cu, Ti Metal and SU-8, AZ 4620 Polymer Dielectric
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Huang, Yen-Jun; Hsieh, Yen-Hui; Shih, Jian-Yu; Chen, Han-Chun; Leu, Jihperng; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:48:57Z |
Polymer TSV Fabrication Scheme with Its Electrical and Reliability Test Vehicle
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Lee, Shih-Wei; Shih, Jian-Yu; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:48:56Z |
Advanced Crystal Component Package with Silicon TSV Interposer Using 3D Integration and Novel SU-8 Polymer Sealing Bonding Structure
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Shih, Jian-Yu; Chen, Yen-Chi; Lee, Shih-Wei; Hu, Yu-Chen; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2015-12-02T03:00:54Z |
A Novel Si-based X'tal Oscillator Device Using 3D Integration Technologies
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Shih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chen, Kuan-Neng |
| 國立交通大學 |
2015-11-26T00:55:40Z |
三維積體電路之頻率振盪元件封裝特性與應用
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施建宇; Shih, Jian-Yu; 陳冠能; Chen, Kuan-Neng |
| 國立交通大學 |
2015-07-21T11:20:27Z |
Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding
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Shih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2015-07-21T08:28:28Z |
Device Characteristics of TSV-Based Piezoelectric Resonator With Load Capacitance and Static Capacitance Modification
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Shih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:36:50Z |
Motional Resistance Issue of TSV-Based Resonator Device and Its Improvement With a Concave Cu TSV Structural Design
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Shih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:36:48Z |
Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications
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Shih, Jian-Yu; Huang, Wen-Chun; Ko, Cheng-Ta; Yang, Zheng; Hu, Sheng-Hsiang; Leu, Jihperng; Chou, Keng C.; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:46Z |
TSV-Based Quartz Crystal Resonator Using 3D Integration and Si Packaging Technologies
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Shih, Jian-Yu; Chen, Yen-Chi; Chiang, Cheng-Hao; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:31:58Z |
Advanced TSV-Based Crystal Resonator Devices Using 3-D Integration Scheme With Hermetic Sealing
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Shih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:21:13Z |
Wafer-level three-dimensional integrated circuits (3D IC): Schemes and key technologies
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Lai, Ming-Fang; Li, Shih-Wei; Shih, Jian-Yu; Chen, Kuan-Neng |
| 淡江大學 |
2008-10 |
紊流度對分離及再接觸流流場效應探討
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陳增源; Chen, Tzeng-yuan; 施建宇; Shih, Jian-yu |
| 淡江大學 |
2007 |
紊流強度對三維背階流效應探討
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施建宇; Shih, Jian-yu |
Showing items 1-16 of 16 (1 Page(s) Totally)
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