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Showing items 1-5 of 5 (1 Page(s) Totally)
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| 國立臺灣科技大學 |
2008 |
A Process Model of Wafer Thinning by Diamond Grinding
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Chen, C.-C. A.; Shu, Li-Sheng |
| 國立臺灣科技大學 |
2008 |
Estimation of Total Thickness Variation for Wafer Thinning by Diamond Grinding Process
|
Chen, C.-C. A.; Shu, Li-Sheng |
| 國立臺灣科技大學 |
2006 |
3D Geometric Model of Wafer Shape for Diamond Grinding of Silicon Wafers
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Chen, C.-C. A.; Shu, Li-Sheng |
| 國立臺灣科技大學 |
2006 |
Extracting Specific Domain Terminologies to Establish CMP Ontology-Based Knowledge System
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Chen, C.-C. A.; Shu, Li-Sheng |
| 國立臺灣科技大學 |
2003-09 |
Mechano-Chemical Polishing of Silicon Wafers
|
Chen, C.-C. A.; Shu, Li-Sheng ; Lee, Shah-Rong |
Showing items 1-5 of 5 (1 Page(s) Totally)
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