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Institution Date Title Author
國立臺灣科技大學 2008 A Process Model of Wafer Thinning by Diamond Grinding Chen, C.-C. A.; Shu, Li-Sheng
國立臺灣科技大學 2008 Estimation of Total Thickness Variation for Wafer Thinning by Diamond Grinding Process Chen, C.-C. A.; Shu, Li-Sheng
國立臺灣科技大學 2006 3D Geometric Model of Wafer Shape for Diamond Grinding of Silicon Wafers Chen, C.-C. A.; Shu, Li-Sheng
國立臺灣科技大學 2006 Extracting Specific Domain Terminologies to Establish CMP Ontology-Based Knowledge System Chen, C.-C. A.; Shu, Li-Sheng
國立臺灣科技大學 2003-09 Mechano-Chemical Polishing of Silicon Wafers Chen, C.-C. A.; Shu, Li-Sheng ; Lee, Shah-Rong

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