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Showing items 1-5 of 5 (1 Page(s) Totally)
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| 臺大學術典藏 |
2018-09-10T07:13:18Z |
Comparison of cure conditions for rigid rod epoxy and bisphenol A epoxy using thermomechanical analysis
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WEI-FANG SU;Smith, J.D.B.;K.F.;Schoch Jr.;Su, W.F.A.;WEI-FANG SU; Su, W.F.A.; Schoch Jr.; K.F.; Smith, J.D.B.; WEI-FANG SU |
| 臺大學術典藏 |
2018-09-10T05:32:33Z |
Electroluminescent edge emission from poly (phenylene vinylene) films
|
WEI-FANG SU;Kun, Z.K.;Smith, J.D.B.;K.F.;Schoch Jr.;Young, R.M.;Su, W.-F.A.;WEI-FANG SU; Su, W.-F.A.; Young, R.M.; Schoch Jr.; K.F.; Smith, J.D.B.; Kun, Z.K.; WEI-FANG SU |
| 國立臺灣大學 |
1998 |
Comparison of Cure Conditions for a Rigid Rod Epoxy and a Bisphenol A Epoxy Using Thermomechanical Analysis
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Su, W-F. A.; Schoch, K-F; Smith, J-D B. |
| 國立臺灣大學 |
1995 |
Electroluminescent edge emission from poly (phenylene vinylene) films
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Su, W-F. A.; R-M Young, Schoch, K-F; Smith, J-D B. |
| 國立臺灣大學 |
1988 |
UV Curable Adhesives for Electronic Packaging
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Su, W-F. A.; Smith, J-D B.; Long, A-H |
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