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"song j m"
Showing items 46-55 of 80 (8 Page(s) Totally)
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| 國立東華大學 |
2006-03 |
Properties of Au Deposits on Electronic Substrates by Utilizing Nanoparticle Suspensions
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Song,J. M.; Chen, I. G.; Kao,T. H.; Dong,T. Y.; Wu,H. H. |
| 國立東華大學 |
2006 |
Microstructural Characteristics and Vibration Fracture Properties of Sn-Ag-Cu-TM (TM=Co, Ni and Zn) Alloys
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Song,J. M.; Huang,C. F.; Chuang, H. Y. |
| 國立東華大學 |
2006 |
Interfacial Reactions between Bi-Ag High Temperature Solders and Metallic Substrates
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Song,J. M.; Chuang,H. Y.; Wu,Z. M. |
| 國立東華大學 |
2006 |
Dissolution Behavior of Cu and Ag Substrates in Molten Solders
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Song,J. M.; Lin,K. L.; Yeh,P. Y. |
| 國立東華大學 |
2006 |
Effect of Zn Content on the Vibration Fracture Behavior of Sn-Zn and Sn-Zn-Bi Solders
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Song,J. M.; Lui,T. S.; Chen,L. H.; Chang,Y. L. |
| 國立東華大學 |
2006 |
Variable Eutectic Temperature Caused by Inhomogeneous Solute Distribution in Sn-Zn System
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Song,J. M.; Wu,Z. M. |
| 國立東華大學 |
2006 |
Continuity and Adhesion of Gold Deposits on Electronic substrates by Utilizing Nanoparticle Suspensions
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Song,J. M.; Chen,I. G.; Dong,T. Y.; Wu, H. H. |
| 國立東華大學 |
2006 |
The Influence of Al Content and Annealing on Vibration Fracture Properties of Wrought Mg-Al-Zn Alloys
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Song,J. M.; Lui,T. S.; Chen,L. H.; Chang,H. W. |
| 國立東華大學 |
2006 |
Sedimentation of Intermetallics in Liquid Lead-free Solders
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Song,J. M.; Chuang, H. Y.; Shen,Y. L. |
| 國立東華大學 |
2005-04 |
A Study on Vibration Induced Deformation Structure of Sn-based Pb-free Solders
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Song,J. M.; Chen,L. H.; Lui,T. S. |
Showing items 46-55 of 80 (8 Page(s) Totally)
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