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"song j m"的相關文件
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| 國立東華大學 |
2008-12 |
Electromigration Reliability with Respect to Cu Content in Solder Joint System
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Song,J. M.; Lai,Yi-Shao |
| 國立東華大學 |
2008-12 |
Metallurgical Perspective on Alloying Modification of Sn-Ag-Cu Solders
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Song,J. M.; Li-Wei Lin,; Ning-Cheng Lee,; Yi-Shao Lai,; Ying-Ta Chiu, |
| 國立東華大學 |
2008-10 |
Alloying Modification of Sn-Ag-Cu Solders by Manganese and Titanium
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Song, J. M.; Lai,Y. S.; Uan,J. Y.; Lee,N. C.; Chiu,Y. T. |
| 國立東華大學 |
2008-10 |
Alloying Design of Sn-Ag-Cu Solders for the Improvement in Drop Test Performance
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Song,J. M.; Yi-Shao Lai,; Li-Wei Lin,; Ying-Ta Chiu; Ning-Cheng Lee |
| 國立東華大學 |
2008-10 |
Nanoindentation analysis of interfacial IMCs in electronic solder joints
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Song,J. M.; Su,Chien-Wei; Shen,Yu-Lin |
| 國立東華大學 |
2008 |
A Novel Method for Preparing Vertically-grown Single Crystalline gold Nanowire
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Song,J. M.; Chen,I. G.; Nien,Y. T.; Tung,H. T. |
| 國立東華大學 |
2008 |
Intermetallic Formation Induced Substrate Dissolution in Electroless Ni(P)-solder Interconnections
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Song,J. M.; Liu,Y. R.; Chiu,Y. T.; Lai,Y. S.; Su,C. W. |
| 國立東華大學 |
2008 |
Synthesis of Surfactant-free Aligned Single Crystal Copper Nanowire by Thermal-Assisted Photoreduction
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Song,J. M.; Dong,T. Y.; Chen,I. G.; Hwang,W. S.; Tung,H. T. |
| 國立東華大學 |
2008 |
Ball Impact Responses of Ni or Ge Doped Sn-Ag-Cu Solder Joints
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Song,J. M.; Chang,H.C.; Chiu,Y. T.; Lai,Y. S. |
| 國立東華大學 |
2008 |
Size and substrate effects on microstructure and shear properties of solder joints
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Song,J. M.; Yi-Shao Lai,; Gwo-Wei Lee,; Ying-Ta Chiu,; Chien-Wei Su, |
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