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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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"song j m"的相關文件
顯示項目 26-35 / 80 (共8頁)
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| 國立東華大學 |
2008 |
A Novel Method for Preparing Vertically-grown Single Crystalline gold Nanowire
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Song,J. M.; Chen,I. G.; Nien,Y. T.; Tung,H. T. |
| 國立東華大學 |
2008 |
Intermetallic Formation Induced Substrate Dissolution in Electroless Ni(P)-solder Interconnections
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Song,J. M.; Liu,Y. R.; Chiu,Y. T.; Lai,Y. S.; Su,C. W. |
| 國立東華大學 |
2008 |
Synthesis of Surfactant-free Aligned Single Crystal Copper Nanowire by Thermal-Assisted Photoreduction
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Song,J. M.; Dong,T. Y.; Chen,I. G.; Hwang,W. S.; Tung,H. T. |
| 國立東華大學 |
2008 |
Ball Impact Responses of Ni or Ge Doped Sn-Ag-Cu Solder Joints
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Song,J. M.; Chang,H.C.; Chiu,Y. T.; Lai,Y. S. |
| 國立東華大學 |
2008 |
Size and substrate effects on microstructure and shear properties of solder joints
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Song,J. M.; Yi-Shao Lai,; Gwo-Wei Lee,; Ying-Ta Chiu,; Chien-Wei Su, |
| 國立東華大學 |
2008 |
Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections
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Song, J. M.; Yi-Shao Lai; Yao-Ren Liu,; Ying-Ta Chiu ,; Wei-Ting Chen, |
| 國立東華大學 |
2007-03 |
Mechanical properties of Bi-Ag Pb-free die attach solder joints
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Song,J. M.; Wu,Zong-Mou |
| 國立東華大學 |
2007 |
Sedimentation of Cu-rich Intermetallics in Liquid Lead-free Solders
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Song,J. M.; Shen,Y. L.; Chuang,H. Y. |
| 國立東華大學 |
2007 |
The Effect of Low Temperature Solute Elements on Nonequilibrium Eutectic Solidification of Sn-Ag Eutectic Solder
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Song,J. M.; Wu,Z. M.; Chuang,H. Y.; Huang,D. A. |
| 國立東華大學 |
2007 |
Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High Temperature Soldering Applications
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Song,J. M.; Chuang,H. Y.; Wu,Z. M. |
顯示項目 26-35 / 80 (共8頁)
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