|
"song j m"的相關文件
顯示項目 11-35 / 80 (共4頁) 1 2 3 4 > >> 每頁顯示[10|25|50]項目
| 國立臺灣科技大學 |
2015 |
Spontaneous growth of ultra-thin titanium oxides shell on Ag nanowires: an electron energy loss spectroscope observation
|
Tsai, C.-H.;Chen, S.-Y.;Song, J.-M.;Gloter, A. |
| 國立臺灣科技大學 |
2014 |
Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid
|
Li, W.-H.;Lin, P.-S.;Chen, C.-N.;Dong, T.-Y.;Tsai, C.-H.;Kung, W.-T.;Song, J.-M.;Chiu, Y.-T.;Yang, P.-F. |
| 國立臺灣科技大學 |
2013 |
Thermal stability of Cu at Ag core-shell nanoparticles
|
Tsai, C.-H.;Chen, S.-Y.;Song, J.-M.;Chen, I.-G.;Lee, H.-Y. |
| 國立臺灣科技大學 |
2013 |
Effect of surface physics of metal oxides on the ability to form metallic nanowires
|
Song, J.-M.;Chen, S.-Y.;Shen, Y.-L.;Tsai, C.-H.;Feng, S.-W.;Tung, H.-T.;Chen, I.-G. |
| 國立臺灣科技大學 |
2012 |
Phase transformation of Cu@Ag core-shell nanoparticles upon heating
|
Tsai, C.-H.;Chen, S.-Y.;Song, J.-M.;Chen, I.-G.;Lee, H.-Y. |
| 國立臺灣科技大學 |
2012 |
Cu to Cu bonding with Cu@Ag core-shell nanoparticles
|
Song, J.-M.;Chang, C.-H.;Wu, J.-S.;Tsai, C.-H.;Chen, S.-Y. |
| 國立臺灣科技大學 |
2012 |
Kinetic study of Pt nanocrystal deposition on Ag nanowires with clean surfaces via galvanic replacement
|
Shen, Y.-L.;Chen, S.-Y.;Song, J.-M.;Chen, I.-G. |
| 國立臺灣科技大學 |
2012 |
Ultra-long pt nanolawns supported on Tio2-coated carbon fibers as 3D hybrid catalyst for methanol oxidation
|
Shen, Y.-L.;Chen, S.-Y.;Song, J.-M.;Chen, I.-G. |
| 國立臺灣科技大學 |
2011 |
Direct growth of ultra-long platinum nanolawns on a semiconductor photocatalyst
|
Shen, Y.L.;Chen, S.Y.;Song, J.M.;Chin, T.K.;Lin, C.H.;Chen, I.G. |
| 國立臺灣科技大學 |
2011 |
Observations on PVP-protected noble metallic nanoparticle deposits upon heating via in situ synchrotron radiation X-ray diffraction
|
Song, J.M.;Chiou, G.D.;Chen, W.T.;Chen, S.Y.;Kao, T.H.;Chen, I.G.;Lee, H.Y. |
| 國立東華大學 |
2008-12 |
Electromigration Reliability with Respect to Cu Content in Solder Joint System
|
Song,J. M.; Lai,Yi-Shao |
| 國立東華大學 |
2008-12 |
Metallurgical Perspective on Alloying Modification of Sn-Ag-Cu Solders
|
Song,J. M.; Li-Wei Lin,; Ning-Cheng Lee,; Yi-Shao Lai,; Ying-Ta Chiu, |
| 國立東華大學 |
2008-10 |
Alloying Modification of Sn-Ag-Cu Solders by Manganese and Titanium
|
Song, J. M.; Lai,Y. S.; Uan,J. Y.; Lee,N. C.; Chiu,Y. T. |
| 國立東華大學 |
2008-10 |
Alloying Design of Sn-Ag-Cu Solders for the Improvement in Drop Test Performance
|
Song,J. M.; Yi-Shao Lai,; Li-Wei Lin,; Ying-Ta Chiu; Ning-Cheng Lee |
| 國立東華大學 |
2008-10 |
Nanoindentation analysis of interfacial IMCs in electronic solder joints
|
Song,J. M.; Su,Chien-Wei; Shen,Yu-Lin |
| 國立東華大學 |
2008 |
A Novel Method for Preparing Vertically-grown Single Crystalline gold Nanowire
|
Song,J. M.; Chen,I. G.; Nien,Y. T.; Tung,H. T. |
| 國立東華大學 |
2008 |
Intermetallic Formation Induced Substrate Dissolution in Electroless Ni(P)-solder Interconnections
|
Song,J. M.; Liu,Y. R.; Chiu,Y. T.; Lai,Y. S.; Su,C. W. |
| 國立東華大學 |
2008 |
Synthesis of Surfactant-free Aligned Single Crystal Copper Nanowire by Thermal-Assisted Photoreduction
|
Song,J. M.; Dong,T. Y.; Chen,I. G.; Hwang,W. S.; Tung,H. T. |
| 國立東華大學 |
2008 |
Ball Impact Responses of Ni or Ge Doped Sn-Ag-Cu Solder Joints
|
Song,J. M.; Chang,H.C.; Chiu,Y. T.; Lai,Y. S. |
| 國立東華大學 |
2008 |
Size and substrate effects on microstructure and shear properties of solder joints
|
Song,J. M.; Yi-Shao Lai,; Gwo-Wei Lee,; Ying-Ta Chiu,; Chien-Wei Su, |
| 國立東華大學 |
2008 |
Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections
|
Song, J. M.; Yi-Shao Lai; Yao-Ren Liu,; Ying-Ta Chiu ,; Wei-Ting Chen, |
| 國立東華大學 |
2007-03 |
Mechanical properties of Bi-Ag Pb-free die attach solder joints
|
Song,J. M.; Wu,Zong-Mou |
| 國立東華大學 |
2007 |
Sedimentation of Cu-rich Intermetallics in Liquid Lead-free Solders
|
Song,J. M.; Shen,Y. L.; Chuang,H. Y. |
| 國立東華大學 |
2007 |
The Effect of Low Temperature Solute Elements on Nonequilibrium Eutectic Solidification of Sn-Ag Eutectic Solder
|
Song,J. M.; Wu,Z. M.; Chuang,H. Y.; Huang,D. A. |
| 國立東華大學 |
2007 |
Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High Temperature Soldering Applications
|
Song,J. M.; Chuang,H. Y.; Wu,Z. M. |
顯示項目 11-35 / 80 (共4頁) 1 2 3 4 > >> 每頁顯示[10|25|50]項目
|