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機構	日期	題名	作者
國立臺灣科技大學	2012	Cu to Cu bonding with Cu@Ag core-shell nanoparticles	Song, J.-M.;Chang, C.-H.;Wu, J.-S.;Tsai, C.-H.;Chen, S.-Y.
國立臺灣科技大學	2012	Kinetic study of Pt nanocrystal deposition on Ag nanowires with clean surfaces via galvanic replacement	Shen, Y.-L.;Chen, S.-Y.;Song, J.-M.;Chen, I.-G.
國立臺灣科技大學	2012	Ultra-long pt nanolawns supported on Tio2-coated carbon fibers as 3D hybrid catalyst for methanol oxidation	Shen, Y.-L.;Chen, S.-Y.;Song, J.-M.;Chen, I.-G.
國立臺灣科技大學	2011	Direct growth of ultra-long platinum nanolawns on a semiconductor photocatalyst	Shen, Y.L.;Chen, S.Y.;Song, J.M.;Chin, T.K.;Lin, C.H.;Chen, I.G.
國立臺灣科技大學	2011	Observations on PVP-protected noble metallic nanoparticle deposits upon heating via in situ synchrotron radiation X-ray diffraction	Song, J.M.;Chiou, G.D.;Chen, W.T.;Chen, S.Y.;Kao, T.H.;Chen, I.G.;Lee, H.Y.
國立東華大學	2008-12	Electromigration Reliability with Respect to Cu Content in Solder Joint System	Song,J. M.; Lai,Yi-Shao
國立東華大學	2008-12	Metallurgical Perspective on Alloying Modification of Sn-Ag-Cu Solders	Song,J. M.; Li-Wei Lin,; Ning-Cheng Lee,; Yi-Shao Lai,; Ying-Ta Chiu,
國立東華大學	2008-10	Alloying Modification of Sn-Ag-Cu Solders by Manganese and Titanium	Song, J. M.; Lai,Y. S.; Uan,J. Y.; Lee,N. C.; Chiu,Y. T.
國立東華大學	2008-10	Alloying Design of Sn-Ag-Cu Solders for the Improvement in Drop Test Performance	Song,J. M.; Yi-Shao Lai,; Li-Wei Lin,; Ying-Ta Chiu; Ning-Cheng Lee
國立東華大學	2008-10	Nanoindentation analysis of interfacial IMCs in electronic solder joints	Song,J. M.; Su,Chien-Wei; Shen,Yu-Lin
國立東華大學	2008	A Novel Method for Preparing Vertically-grown Single Crystalline gold Nanowire	Song,J. M.; Chen,I. G.; Nien,Y. T.; Tung,H. T.
國立東華大學	2008	Intermetallic Formation Induced Substrate Dissolution in Electroless Ni(P)-solder Interconnections	Song,J. M.; Liu,Y. R.; Chiu,Y. T.; Lai,Y. S.; Su,C. W.
國立東華大學	2008	Synthesis of Surfactant-free Aligned Single Crystal Copper Nanowire by Thermal-Assisted Photoreduction	Song,J. M.; Dong,T. Y.; Chen,I. G.; Hwang,W. S.; Tung,H. T.
國立東華大學	2008	Ball Impact Responses of Ni or Ge Doped Sn-Ag-Cu Solder Joints	Song,J. M.; Chang,H.C.; Chiu,Y. T.; Lai,Y. S.
國立東華大學	2008	Size and substrate effects on microstructure and shear properties of solder joints	Song,J. M.; Yi-Shao Lai,; Gwo-Wei Lee,; Ying-Ta Chiu,; Chien-Wei Su,
國立東華大學	2008	Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections	Song, J. M.; Yi-Shao Lai; Yao-Ren Liu,; Ying-Ta Chiu ,; Wei-Ting Chen,
國立東華大學	2007-03	Mechanical properties of Bi-Ag Pb-free die attach solder joints	Song,J. M.; Wu,Zong-Mou
國立東華大學	2007	Sedimentation of Cu-rich Intermetallics in Liquid Lead-free Solders	Song,J. M.; Shen,Y. L.; Chuang,H. Y.
國立東華大學	2007	The Effect of Low Temperature Solute Elements on Nonequilibrium Eutectic Solidification of Sn-Ag Eutectic Solder	Song,J. M.; Wu,Z. M.; Chuang,H. Y.; Huang,D. A.
國立東華大學	2007	Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High Temperature Soldering Applications	Song,J. M.; Chuang,H. Y.; Wu,Z. M.
國立東華大學	2007	Interdiffusion Behavior at the Interfaces between Deposits of Au Nanoparticles and Electronic Substrates	Song,J. M.; Chen,I. G.; Hwang,W. S.; Dong,T. Y.; Kao,T. H.
國立東華大學	2007	Thermal and Tensile Properties of Bi-Ag Alloy	Song,J. M.; Chuang,H. Y.; Wen,T. X.
國立東華大學	2007	Vibration Fracture Properties of a Light Weight Mg-Li-Zn Alloy	Song,J. M.; Wen,T. X.; Wang,J. Y.
國立東華大學	2007	Microstructural Characteristics and Vibration Fracture Properties of Al-Mg-Si Alloys with Excess Cu and Ni	Song,J. M.; Lin,T. Y.; Chuang,H. Y.
國立東華大學	2007	Two Stage Nonequilibrium Eutectic Transformation in a Sn-3.5Ag-3In Solder	Song, J. M.; Wu,Z. M.; Huang,D. A.
國立東華大學	2007	Electrical resistivity and interfacial behavior of Bi-Ag/Cu high temperature solder joints	Song,J. M.; Chuang,Hsin-Yi; Lew,Kar-Kit
國立東華大學	2007	Fabrication of thermal reduced metallic nano-wires on titanium dioxide	Song,J. M.; Chen,I. G.; Tung,H. T.
國立東華大學	2006-07	Interfacial Behaviour between Bi-Ag based Solders and Ni substrate	Song,J. M.; Chuang,H. Y.
國立東華大學	2006-07	Tensile properties of Bi-Ag new Pb-free die attach solder and the joints	Song,J. M.; Wen,T. X.; Wu, Z. M.
國立東華大學	2006-03	Deposition of Conductive Films on Electronic Substrates by Using Gold Nanopowders	Song, J. M.; Chen, I. G.; Kao,T. H.; Dong,T. Y.; Wu,H. H.
國立東華大學	2006-03	Properties of Au Deposits on Electronic Substrates by Utilizing Nanoparticle Suspensions	Song,J. M.; Chen, I. G.; Kao,T. H.; Dong,T. Y.; Wu,H. H.
國立東華大學	2006	Microstructural Characteristics and Vibration Fracture Properties of Sn-Ag-Cu-TM (TM=Co, Ni and Zn) Alloys	Song,J. M.; Huang,C. F.; Chuang, H. Y.
國立東華大學	2006	Interfacial Reactions between Bi-Ag High Temperature Solders and Metallic Substrates	Song,J. M.; Chuang,H. Y.; Wu,Z. M.
國立東華大學	2006	Dissolution Behavior of Cu and Ag Substrates in Molten Solders	Song,J. M.; Lin,K. L.; Yeh,P. Y.
國立東華大學	2006	Effect of Zn Content on the Vibration Fracture Behavior of Sn-Zn and Sn-Zn-Bi Solders	Song,J. M.; Lui,T. S.; Chen,L. H.; Chang,Y. L.
國立東華大學	2006	Variable Eutectic Temperature Caused by Inhomogeneous Solute Distribution in Sn-Zn System	Song,J. M.; Wu,Z. M.
國立東華大學	2006	Continuity and Adhesion of Gold Deposits on Electronic substrates by Utilizing Nanoparticle Suspensions	Song,J. M.; Chen,I. G.; Dong,T. Y.; Wu, H. H.
國立東華大學	2006	The Influence of Al Content and Annealing on Vibration Fracture Properties of Wrought Mg-Al-Zn Alloys	Song,J. M.; Lui,T. S.; Chen,L. H.; Chang,H. W.
國立東華大學	2006	Sedimentation of Intermetallics in Liquid Lead-free Solders	Song,J. M.; Chuang, H. Y.; Shen,Y. L.
國立東華大學	2005-04	A Study on Vibration Induced Deformation Structure of Sn-based Pb-free Solders	Song,J. M.; Chen,L. H.; Lui,T. S.
國立東華大學	2005	Compositional Effects on the Microstructure and Vibration Fracture Properties of Sn-Zn-Bi alloys	Song,J. M.; Lui,T. S.; Chen,L. H.; Chang,Y. L.
國立東華大學	2005	Role of Ag in the Formation of Interfacial Intermetallic Phases in Sn-Zn Soldering	Song,J. M.; Liu,P. C.; Lin,K. L.; Shih,C. L.
國立東華大學	2005	Tin Whiskers of Bulk Solders Generated under Resonance	Song,J. M.; Lui,T. S.; Chen,L. H.; Chang,Y. L.
國立東華大學	2005	Effect of Zn Content on the Vibration Fracture Behavior of Sn-Zn and Sn-Zn-Bi Solders	Song,J. M.; Lui,T. S.; Chang,Y. L.; Chen,L. H.
國立東華大學	2005	Dissolution Behavior of Cu and Ag Substrates in Molten Solders	Song,J. M.; Lin,K. L.; Yeh,P. Y.
國立東華大學	2004-06	Wetting Interaction between Pb-free Sn-Zn Series Solders and Cu, Ag Substrates	Song,J. M.; Liu,P. C.; Lin, K. L.
國立東華大學	2004	Effect of Microstructural Refinement on Tensile Behavior of the AC9A Aluminum Alloy Suffering Thermal Shock Fatigue	Song,J. M.; Lui,T. S.; Lin,H. M.; Chen,L. H.; Kao,I. H.
國立東華大學	2004	Vibration Behavior of a Precipitation-hardening Aluminum Alloy under Resonance	Song, J. M.; Lui,T. S.; Chen,T. F.; Chen,L. H.; Horng,J. H.
國立東華大學	2004	Microstructural Characteristics and Vibration Fracture Behavior of Sn-Zn-Ag Solder Alloys	Song, J. M.; Lui,T. S.; Chen,L. H.; Lan,G. F.
國立東華大學	2004	Double Peritectic Behavior of Ag-Zn Intermetallics in Sn-Zn-Ag Solder Alloys	Song,J. M.; Lin,K. L.

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