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Showing items 1-4 of 4 (1 Page(s) Totally)
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| 國立臺灣大學 |
2012 |
加速環境狀態下覆晶晶片尺寸封裝體之機率設計與可靠度分析
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蘇志彥; Su, Chih-Yen |
| 國立臺灣大學 |
2011 |
Quantitative reliability analysis of flip-chip packages under thermal-cyclic loading and in consideration of parameter uncertainties
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Hsu, Yao; Su, Chih-Yen; Wu, Wen-Fang |
| 臺大學術典藏 |
2011 |
Quantitative reliability analysis of flip-chip packages under thermal-cyclic loading and in consideration of parameter uncertainties
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Wu, Wen-Fang; Su, Chih-Yen; Hsu, Yao; Hsu, Yao; Su, Chih-Yen; Wu, Wen-Fang |
| 國立成功大學 |
2007-06-20 |
造型椅有限元素分析與設計
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蘇志彥; Su, Chih-Yen |
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