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Institution Date Title Author
國立臺灣大學 2012 加速環境狀態下覆晶晶片尺寸封裝體之機率設計與可靠度分析 蘇志彥; Su, Chih-Yen
國立臺灣大學 2011 Quantitative reliability analysis of flip-chip packages under thermal-cyclic loading and in consideration of parameter uncertainties Hsu, Yao; Su, Chih-Yen; Wu, Wen-Fang
臺大學術典藏 2011 Quantitative reliability analysis of flip-chip packages under thermal-cyclic loading and in consideration of parameter uncertainties Wu, Wen-Fang; Su, Chih-Yen; Hsu, Yao; Hsu, Yao; Su, Chih-Yen; Wu, Wen-Fang
國立成功大學 2007-06-20 造型椅有限元素分析與設計 蘇志彥; Su, Chih-Yen

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