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"su francis"
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| 國立成功大學 |
2004-03 |
Three-dimensional modeling of mold filling in microelectronics encapsulation process
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Chang, Rong-Yeu; Yang, Wen-Hsien; Hwang, Sheng-Jye; Su, Francis |
| 國立成功大學 |
2003-06 |
Computer-aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance
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Lee, Hung-Lung; Chang, Shyang-Jye; Hwang, Sheng-Jye; Su, Francis; Chen, S. K. |
| 國立成功大學 |
2003-03 |
An efficient solution for wire sweep analysis in IC packaging
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Su, Jerry; Hwang, Sheng-Jye; Su, Francis; Chen, Shou-Kang |
| 國立成功大學 |
2003-01 |
Computer-aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance
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Lee, Hung-Lung; Chang, Shyang-Jye; Hwang, Sheng-Jye; Su, Francis; Chen, S. K. |
| 國立成功大學 |
2000-12 |
Prediction of paddle shift via 3-D TSOP modeling
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Su, Francis; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn-Yuan |
Showing items 1-5 of 5 (1 Page(s) Totally)
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