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"su francis"的相关文件
显示项目 1-5 / 5 (共1页)
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| 國立成功大學 |
2004-03 |
Three-dimensional modeling of mold filling in microelectronics encapsulation process
|
Chang, Rong-Yeu; Yang, Wen-Hsien; Hwang, Sheng-Jye; Su, Francis |
| 國立成功大學 |
2003-06 |
Computer-aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance
|
Lee, Hung-Lung; Chang, Shyang-Jye; Hwang, Sheng-Jye; Su, Francis; Chen, S. K. |
| 國立成功大學 |
2003-03 |
An efficient solution for wire sweep analysis in IC packaging
|
Su, Jerry; Hwang, Sheng-Jye; Su, Francis; Chen, Shou-Kang |
| 國立成功大學 |
2003-01 |
Computer-aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance
|
Lee, Hung-Lung; Chang, Shyang-Jye; Hwang, Sheng-Jye; Su, Francis; Chen, S. K. |
| 國立成功大學 |
2000-12 |
Prediction of paddle shift via 3-D TSOP modeling
|
Su, Francis; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn-Yuan |
显示项目 1-5 / 5 (共1页)
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