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Showing items 1-34 of 34  (1 Page(s) Totally)
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Institution Date Title Author
國家衛生研究院 2019-05 Multi-labeled electrochemical sensor for cost-efficient detection of single nucleotide substitutions in folded nucleic acids Sun, SC;Dou, HY;Chuang, MC;Kolpashchikov, DM
國立交通大學 2019-04-02T06:00:03Z Reduction of leakage current in chemical-vapor-deposited Ta2O5 thin films by furnace N2O annealing Sun, SC; Chen, TF
國立交通大學 2019-04-02T05:59:33Z Electrical properties of O-2 and N-2 annealed (Ba,Sr)TiO3 thin films Tsai, MS; Sun, SC; Tseng, TY
國立交通大學 2019-04-02T05:59:23Z Comparison of the diffusion barrier properties of chemical-vapor-deposited TaN and sputtered TaN between Cu and Si Tsai, MH; Sun, SC; Tsai, CE; Chuang, SH; Chiu, HT
國立交通大學 2019-04-02T05:59:15Z METALORGANIC CHEMICAL-VAPOR-DEPOSITION OF TANTALUM NITRIDE BY TERTBUTYLIMIDOTRIS(DIETHYLAMIDO)TANTALUM FOR ADVANCED METALLIZATION TSAI, MH; SUN, SC; CHIU, HT; TSAI, CE; CHUANG, SH
國立交通大學 2019-04-02T05:58:30Z Leakage current reduction in chemical-vapor-deposited Ta2O5 films by rapid thermal annealing in N2O Sun, SC; Chen, TF
國家衛生研究院 2017-09 A mutation-resistant deoxyribozyme OR gate for highly selective detection of viral nucleic acids Kamar, O;Sun, SC;Lin, CH;Chung, WY;Lee, MS;Liao, YC;Kolpashchikov, DM;Chuang, MC
國立交通大學 2014-12-08T15:46:54Z Effect of bottom electrode materials and annealing treatments on the electrical characteristics of Ba0.47Sr0.53TiO3 film capacitors Tsai, MS; Sun, SC; Tseng, TY
國立交通大學 2014-12-08T15:46:14Z Effect of bottom electrode materials on the electrical and reliability characteristics of (Ba, Sr)TiO3 capacitors Tsai, MS; Sun, SC; Tseng, TY
國立交通大學 2014-12-08T15:27:57Z THERMAL-OXIDATION OF LIGHTLY-DOPED AND HEAVILY-DOPED SILICON IN PURE N2O SUN, SC; CHANG, HY
國立交通大學 2014-12-08T15:27:53Z RAPID THERMAL-OXIDATION OF LIGHTLY DOPED SILICON IN N2O SUN, SC; WANG, LS; YEH, FL; LAI, TS; LIN, YH
國立交通大學 2014-12-08T15:27:51Z A NOVEL APPROACH FOR LEAKAGE CURRENT REDUCTION OF LPCVD TA(2)O(5) AND TIO(2) FILMS BY RAPID THERMAL N(2)O ANNEALING SUN, SC; CHEN, TF
國立交通大學 2014-12-08T15:27:49Z CHARACTERIZATION OF CHEMICAL-MECHANICAL POLISHING DIELECTRICS FOR MULTILEVEL METALLIZATION SUN, SC; YEH, FL; TIEN, HZ
國立交通大學 2014-12-08T15:27:48Z Performance of MOCVD tantalum nitride diffusion barrier for copper metallization Sun, SC; Tsai, MH; Tsai, CE; Chiu, HT
國立交通大學 2014-12-08T15:27:48Z Rapid thermal chemical vapor deposition of in-situ nitrogen-doped polysilicon for dual gate CMOS Sun, SC; Wang, LS; Yeh, FL; Chen, CH
國立交通大學 2014-12-08T15:27:45Z Gate oxynitride grown in N2O and annealed in no using rapid thermal processing Sun, SC; Chen, CH; Lou, JC; Yen, LW; Lin, CJ
國立交通大學 2014-12-08T15:27:45Z Rapid thermal chemical vapor deposition of nitrogen-doped polysilicon for high-performance and high-reliability CMOS technology Sun, SC; Wang, LS; Yeh, FL
國立交通大學 2014-12-08T15:27:44Z MOS characteristics of N2O-grown and NO-annealed oxynitrides Sun, SC; Chen, CH; Lou, JC
國立交通大學 2014-12-08T15:27:44Z Properties of metalorganic chemical vapor deposited tantalum nitride thin films Sun, SC; Tsai, MH; Tsai, CE; Chiu, HT
國立交通大學 2014-12-08T15:27:43Z A comparative study of CVD TiN and CVD TaN diffusion barriers for copper interconnection Sun, SC; Tsai, MH; Chiu, HT; Chuang, SH; Tsai, CE
國立交通大學 2014-12-08T15:27:43Z Characterization and optimization of NO-nitrided gate oxide by RTP Sun, SC; Chen, CH; Yen, DLW; Lin, CJ
國立交通大學 2014-12-08T15:27:23Z Evaluation of PTFE nanoemulsion as a low dielectric constant material ILD Sun, SC; Chiang, YC; Rosenmayer, CT; Teguh, J; Wu, H
國立交通大學 2014-12-08T15:04:20Z CHARACTERIZATIONS OF OXIDE GROWN BY N2O CHAO, TS; CHEN, WH; SUN, SC; CHANG, HY
國立交通大學 2014-12-08T15:03:39Z COMPARISON OF CHEMICAL-VAPOR-DEPOSITION OF TIN USING TETRAKIS-DIETHYLAMINO-TITANIUM AND TETRAKIS-DIMETHYLAMINO-TITANIUM SUN, SC; TSAI, MH
國立交通大學 2014-12-08T15:03:13Z METALORGANIC CHEMICAL-VAPOR-DEPOSITION OF TANTALUM NITRIDE BY TERTBUTYLIMIDOTRIS(DIETHYLAMIDO)TANTALUM FOR ADVANCED METALLIZATION TSAI, MH; SUN, SC; CHIU, HT; TSAI, CE; CHUANG, SH
國立交通大學 2014-12-08T15:03:02Z Metal-organic chemical vapor deposition of tantalum nitride barrier layers for ULSI applications Tsai, MH; Sun, SC; Lee, CP; Chiu, HT; Tsai, CE; Chuang, SH; Wu, SC
國立交通大學 2014-12-08T15:02:53Z Effect of rapid thermal annealing on the electrical and physical properties of metalorganic chemical-vapor-deposited TiN Sun, SC; Tsai, MH
國立交通大學 2014-12-08T15:02:46Z Metalorganic chemical vapor deposition of tungsten nitride for advanced metallization Tsai, MH; Sun, SC; Chiu, HT; Chuang, SH
國立交通大學 2014-12-08T15:02:39Z Comparison of the diffusion barrier properties of chemical-vapor-deposited TaN and sputtered TaN between Cu and Si Tsai, MH; Sun, SC; Tsai, CE; Chuang, SH; Chiu, HT
國立交通大學 2014-12-08T15:02:33Z Leakage current reduction in chemical-vapor-deposited Ta2O5 films by rapid thermal annealing in N2O Sun, SC; Chen, TF
國立交通大學 2014-12-08T15:01:56Z Effects of electrode materials and annealing ambients on the electrical properties of TiO2 thin films by metalorganic chemical vapor deposition Sun, SC; Chen, TF
國立交通大學 2014-12-08T15:01:43Z Reduction of leakage current in chemical-vapor-deposited Ta2O5 thin films by furnace N2O annealing Sun, SC; Chen, TF
國立交通大學 2014-12-08T15:01:24Z Effect of oxygen to argon ratio on properties of (Ba,Sr)TiO3 thin films prepared by radio-frequency magnetron sputtering Tsai, MS; Sun, SC; Tseng, TY
國立交通大學 2014-12-08T15:01:10Z Electrical properties of O-2 and N-2 annealed (Ba,Sr)TiO3 thin films Tsai, MS; Sun, SC; Tseng, TY

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