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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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2019臺灣學術機構典藏
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Showing items 1-18 of 18  (1 Page(s) Totally)
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Institution Date Title Author
臺大學術典藏 2022-03-22T08:30:54Z Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:54Z Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:54Z Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:54Z Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:52Z Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:52Z Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:52Z Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:52Z Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:52Z Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:52Z Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:51Z Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:51Z Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:52Z Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:52Z Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:52Z Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:52Z Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:50Z Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:50Z Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG

Showing items 1-18 of 18  (1 Page(s) Totally)
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