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Showing items 1-25 of 83 (4 Page(s) Totally)
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| 國立交通大學 |
2019-04-02T05:59:24Z |
Growth and electrical characterization of Si delta-doped GaInP by low pressure metalorganic chemical vapor deposition
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Wang, CJ; Feng, MS; Chan, SH; Chang, CY; Wu, JH; Sze, SM |
| 國立交通大學 |
2019-04-02T05:59:13Z |
SILICON DELTA-DOPING OF GAINP GROWN BY LOW-PRESSURE METALORGANIC CHEMICAL-VAPOR-DEPOSITION
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WANG, CJ; WU, JW; CHAN, SH; CHANG, CY; SZE, SM; FENG, MS |
| 國立交通大學 |
2019-04-02T05:58:33Z |
Present and future trends in device science and technologies - Preface
|
Shur, MS; Sze, SM; Xu, JM |
| 國立交通大學 |
2014-12-08T15:47:36Z |
Epitaxial growth of the GaN film by remote-plasma metalorganic chemical vapor deposition
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Lai, WC; Chang, CY; Yokoyama, M; Guo, JD; Tsang, JS; Chan, SH; Bow, JS; Wei, SC; Hong, RH; Sze, SM |
| 國立交通大學 |
2014-12-08T15:46:31Z |
Enhancing the oxygen plasma resistance of low-k methylsilsesquioxane by H-2 plasma treatment
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Liu, PT; Chang, TC; Mor, YS; Sze, SM |
| 國立交通大學 |
2014-12-08T15:46:20Z |
Effects of hydrogen on electrical and chemical properties of low-k hydrogen silsesquioxane as an intermetal dielectric for nonetchback processes
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Chang, TC; Liu, PT; Shih, FY; Sze, SM |
| 國立交通大學 |
2014-12-08T15:46:15Z |
Effects of H-2 plasma treatment on low dielectric constant methylsilsesquioxane
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Chang, TC; Liu, PT; Mei, YJ; Mor, YS; Perng, TH; Yang, YL; Sze, SM |
| 國立交通大學 |
2014-12-08T15:46:11Z |
The novel improvement of low dielectric constant methylsilsesquioxane by N2O plasma treatment
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Chang, TC; Liu, PT; Mor, YS; Sze, SM; Yang, YL; Feng, MS; Pan, FM; Dai, BT; Chang, CY |
| 國立交通大學 |
2014-12-08T15:46:07Z |
Effectively blocking copper diffusion at low-k hydrogen silsesquioxane/copper interface
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Liu, PT; Chang, TC; Yang, YL; Cheng, YF; Shih, FY; Lee, JK; Tsai, E; Sze, SM |
| 國立交通大學 |
2014-12-08T15:46:05Z |
The novel precleaning treatment for selective tungsten chemical vapor deposition
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Chang, TC; Mor, YS; Liu, PT; Sze, SM; Yang, YL; Tsai, MS; Chang, CY |
| 國立交通大學 |
2014-12-08T15:45:53Z |
Reliability of multistacked chemical vapor deposited Ti/TiN structure as the diffusion barrier in ultralarge scale integrated metallization
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Liu, PT; Chang, TC; Hu, JC; Yang, YL; Sze, SM |
| 國立交通大學 |
2014-12-08T15:45:43Z |
Enhancement of barrier properties in chemical vapor deposited TiN employing multi-stacked Ti/TiN structure
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Chang, TC; Liu, PT; Yang, YL; Hu, JC; Sze, SM |
| 國立交通大學 |
2014-12-08T15:45:40Z |
Improvement on intrinsic electrical properties of low-k hydrogen silsesquioxane/copper interconnects employing deuterium plasma treatment
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Liu, PT; Chang, TC; Yang, YL; Cheng, YF; Lee, JK; Shih, FY; Tsai, E; Chen, G; Sze, SM |
| 國立交通大學 |
2014-12-08T15:45:26Z |
Characterization of NH3 plasma-treated Ba0.7Sr0.3TiO3 thin films
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Wuu, DS; Horng, RH; Liao, FC; Leu, CC; Huang, TY; Sze, SM; Chen, HY; Chang, CY |
| 國立交通大學 |
2014-12-08T15:45:26Z |
Effects of O-2 plasma treatment on the electric and dielectric characteristics of Ba0.7Sr0.3TiO3 thin films
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Leu, CC; Chan, SH; Chen, HY; Horng, RH; Wuu, DS; Wu, LH; Huang, TY; Chang, CY; Sze, SM |
| 國立交通大學 |
2014-12-08T15:44:50Z |
Effects of NH3-plasma nitridation on the electrical characterizations of low-k hydrogen silsesquioxane with copper interconnects
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Liu, PT; Chang, TC; Yang, YL; Cheng, YF; Sze, SM |
| 國立交通大學 |
2014-12-08T15:44:42Z |
Improvement of post-chemical mechanical planarization characteristics on organic low k methylsilsesquioxane as intermetal dielectric
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Liu, PT; Chang, TC; Huang, MC; Yang, YL; Mor, YS; Tsai, MS; Chung, H; Hou, J; Sze, SM |
| 國立交通大學 |
2014-12-08T15:44:23Z |
Energy and coordinate dependent effective mass and confined electron states in quantum dots
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Li, YM; Voskoboynikov, O; Lee, CP; Sze, SM |
| 國立交通大學 |
2014-12-08T15:44:15Z |
1.55-mu m and infrared-band photoresponsivity of a Schottky barrier porous silicon photodetector
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Lee, MK; Chu, CH; Wang, YH; Sze, SM |
| 國立交通大學 |
2014-12-08T15:43:55Z |
Elimination of dielectric degradation for chemical-mechanical planarization of low-k hydrogen silisesquioxane
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Chang, TC; Liu, PT; Tsai, TM; Yeh, FS; Tseng, TY; Tsai, MS; Chen, BC; Yang, YL; Sze, SM |
| 國立交通大學 |
2014-12-08T15:43:42Z |
Highly reliable chemical-mechanical polishing process for organic low-k methylsilsesquioxane
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Liu, PT; Chang, TC; Huang, MC; Tsai, MS; Sze, SM |
| 國立交通大學 |
2014-12-08T15:43:18Z |
Electron energy level calculations for cylindrical narrow gap semiconductor quantum dot
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Li, YM; Liu, JL; Voskoboynikov, O; Lee, CP; Sze, SM |
| 國立交通大學 |
2014-12-08T15:43:16Z |
Enhancing the resistance of low-k hydrogen silsesquioxane (HSQ) to wet stripper damage
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Chang, TC; Mor, YS; Liu, PT; Tsai, TM; Chen, CW; Mei, YJ; Sze, SM |
| 國立交通大學 |
2014-12-08T15:43:16Z |
The effect of ammonia plasma treatment on low-k methyl-hybrido-silsesquioxane against photoresist stripping damage
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Chang, TC; Mor, YS; Liu, PT; Tsai, TM; Chen, CW; Mei, YJ; Sze, SM |
| 國立交通大學 |
2014-12-08T15:43:16Z |
Improvement of low dielectric constant methylsilsesquioxane by boron implantation treatment
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Chang, TC; Mor, YS; Liu, PT; Tsai, TM; Chen, CW; Sze, SM; Mei, YJ |
Showing items 1-25 of 83 (4 Page(s) Totally)
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