English  |  正體中文  |  简体中文  |  2818750  
???header.visitor??? :  28369491    ???header.onlineuser??? :  644
???header.sponsordeclaration???
 		 
???search.scope??? ???search.advance???
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
???ui.leftmenu.abouttair???
???ui.leftmenu.explanation???

???ui.leftmenu.bartitle???
Repositories
Author
Title
Date
???ui.leftmenu.statisticschart???
???ui.leftmenu.realtimefacts???
???ui.leftmenu.trend???

???index.news???
2019臺灣學術機構典藏
研討會
機構典藏系統RC7版本已
發佈

???ui.leftmenu.copyrighttitle???
???ui.leftmenu.copyrightpublisher???
???ui.leftmenu.copyrightconference???

???ui.leftmenu.link???
機構典藏計畫網站
ROAR
OpenDOAR
SHERPA
OAIster
JAIRO
Ira
DSPACE
RWWR
臺大學術典藏NTU Scholars
???tair.name??? >  ???browser.page.title.author???

"t m tsai"???jsp.browse.items-by-author.description???

???jsp.browse.items-by-author.back???
???jsp.browse.items-by-author.order1??? ???jsp.browse.items-by-author.order2???

Showing items 1-16 of 16  (1 Page(s) Totally)
1 
View [10|25|50] records per page

Institution Date Title Author
國立中山大學 2007-09-01 Spinal somatosensory evoked potential to evaluate neurophysiologic changes associated with postlaminotomy fibrosis: an experimental study. I.M. Jou; T.W. Tai; C.L. Tsai; T.M. Tsai; W.S. Yung; Y.C. Jung
國立中山大學 2007-04-20 Neurophysiologic changes after pre- and postganglionic nerve- root constriction: an experimental study in the rat. H. Matsuda;C.L. Tsai;Y.T. Tseng;A. Noriage; T.M. Tsai;Y.C. Dai;I.M. Jou
國立中山大學 2005 Value of dermatomal somatosensory evoked potentials in detecting acute nerve root injury:an experimental study with special emphasis on stimulus intensity T.M. Tsai;C.L. Tsai;T.S. Lin;C.C. Lin;I.M. Jou
國立中山大學 2005 Leakage conduction behavior in electron-beam-cured nanoporous silicate films P.T. Liu;T.M. Tsai;T.C. Chang
國立中山大學 2004 Method to improve chemical-mechanical-planarization polishing rate of low-k methyl-silsesquiazane for ultralarge scale integrated interconnect application T.C. Chang;T.M. Tsai;P.T. Liu;S.T. Yan;Y.C. Chang;H. Aoki;S.M. Sze;T.Y. Tseng
國立中山大學 2004 Study on the effect of electron beam curing on low-K porous organosilicate glass (OSG) material T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;T.Y. Tseng
國立中山大學 2004 CMP of Ultra Low-k Material Porous-Polysilazane (PPSZ) for Interconnect Applications T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;Y.C. Chang;T.Y. Tseng
國立中山大學 2004 CMP of low-k methylsilsesquiazane with oxygen plasma treatment for multilevel interconnect applications T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;Y.C. Chang;T.Y. Tseng
國立中山大學 2004 CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;T.Y. Tseng
國立中山大學 2004 CMP of ultra low-k Methylsilsesquiazane with oxygen plasma treatment for multilevel interconnect applications T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;T.Y. Tseng
國立中山大學 2004 Method to improve chemical-mechanical-planarization polishing rate of low-k methyl-silsesquiazane for ultralarge scale integraged interconnect application T.C. Chang;T.M. Tsai;P.T. Liu;Y.C. Chang;J. Aoki;S.M. Sze;T.Y. Tseng
國立中山大學 2004 Cu-penetration induced breakdown mechanism for a-SiCN C.W. Chen;P.T. Liu;T.C. Chang;J.H. Yang;T.M. Tsai;H.H. Wu;T.Y. Tseng
國立中山大學 2004 Investigation of the electrical properties and reliability of amorphous SiCN C.W. Chen;T.C. Chang;P.T. Liu;T.M. Tsai;C.H. Huang;J.M. Chen;T.Y. Tseng
國立中山大學 2004 Study on the effect of electron beam curing on low-K porous organosilicate glass (OSG) material T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;T.Y. Tseng
國立中山大學 2003 Direct Patterning of Low-k Hydrogen Silsesquioxane Using X-ray Exposure Technology T.C. Chang;T.M. Tsai;P.T. Liu;Y.S. Mor;C.W. Chen;J.T. Sheu;T.Y. Tseng
國立中山大學 2003 Moisture-induced material instability of porous organosilicate glass T.C. Chang;C.W. Chen;P.T. Liu;Y.S. Mor;H.M. Tsai;T.M. Tsai;S.T. Yan;C.H. Tu;T.Y. Tsing;S.M. Sze

Showing items 1-16 of 16  (1 Page(s) Totally)
1 
View [10|25|50] records per page

DSpace Software Copyright © 2002-2004  MIT   &  Hewlett-Packard   /   Enhanced by   NTU Library IR team