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Institution Date Title Author
臺大學術典藏 2018-09-10T06:02:52Z A high electromagnetic immunity plastic composite package for a 10-gb/s optical transceiver module T.-L. Wu; M.-C. Lin; C.-W. Lin; W.-S. Jou; T.-T. Shih; W.-H. Cheng; TZONG-LIN WU
國立中山大學 2006 A High-Performance and Low-Cost 10Gbps Coaxial DFB Laser Module Packaging By Conventional TO-Can Materials and Processes T.T. Shih;M.C. Lin;W.H. Cheng

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