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"tai ming chi"
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| 國立交通大學 |
2020-10-05T02:01:30Z |
Transient Thermal Damage Simulation for Novel Location-Controlled Grain Technique in Monolithic 3D IC
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Chen, Pin-Jun; Shen, Chih-Ming; Yang, Chih-Chao; Tai, Ming-Chi; Lo, Wei-Chung; Shen, Chang-Hong; Hu, Chenming; Chen, Kuan-Neng |
| 國立交通大學 |
2020-10-05T02:01:28Z |
Monolithic 3D BEOL FinFET switch arrays using location-controlled-grain technique in voltage regulator with better FOM than 2D regulators
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Hsieh, Ping-Yi; Chang, Yi-Jui; Chen, Pin-Jun; Chen, Chun-Liang; Yang, Chih-Chao; Huang, Po-Tsang; Chen, Yi-Jing; Shen, Chih-Ming; Liu, Yu-Wei; Huang, Chien-Chi; Tai, Ming-Chi; Lo, Wei-Chung; Shen, Chang-Hong; Shieh, Jia-Min; Chang, Da-Chiang; Chen, Kuan-Neng; Yeh, Wen-Kuan; Hu, Chenming |
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