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Showing items 1-4 of 4 (1 Page(s) Totally)
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| 國立交通大學 |
2018-08-21T05:57:12Z |
Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration Applications
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Chen, Hsiu-Chi; Kho, Yi-Tung; Huang, Yen-Jun; Hsieh, Yu-Sheng; Chang, Yao-Jen; Tang, Ya-Sheng; Yu, Ting-Yang; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:52Z |
Investigation and Optimization of Ultrathin Buffer Layers Used in Cu/Sn Eutectic Bonding
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Tang, Ya-Sheng; Chen, Hsiu-Chi; Kho, Yi-Tung; Hsieh, Yu-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:52:50Z |
Investigation of Co Thin Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM With Sn, SnCu, and SAC Solders Joints
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Tang, Ya-Sheng; Derakhshandeh, Jaber; Kho, Yi-Tung; Chang, Yao-Jen; Slabbekoorn, John; De Preter, Inge; Vanstreels, Kris; Rebibis, Kenneth June; Beyne, Eric; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:21:23Z |
Wafer-level Cu-Cu bonding technology
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Tang, Ya-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng |
Showing items 1-4 of 4 (1 Page(s) Totally)
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