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Institution Date Title Author
國立成功大學 2022-12 2022 Taiwan lipid guidelines for primary prevention Huang;Po-Hsun;Lu;Ya-Wen;Tsai;Yi-Lin;Wu;Yen-Wen;Li;Hung-Yuan;Chang;Hsin-Yun;Wu;Chih-Hsing;Yang;Chih-Yu;Tarng;Der-Cherng;Huang;Chin-Chou;Ho;Li-Ting;Lin;Chao-Feng;Chien;Shih-Chieh;Wu;Yih-Jer;Yeh;Hung-I;Pan;Wen-Harn;Li;Yi-Heng
國立成功大學 2022-01 Epoxy Molding Compound Filler Clogging Simulation During Integrated Circuit Encapsulation Process Chen;Bo-Heng;Hwang;Sheng-Jye;Chang;Yu-Yang;Yang;Yu-Shuo;Lee;Huei-Huang;Huang;Bing-Yuan;Hu;Ian;Chen;Dao-Long;Tarng;David;Hung;C, P.
國立成功大學 2021-05 Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu Lin;Ting-Chun;Liang;Chien-Lung;Wang;Shan-Bo;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Lin;Kwang-Lung
國立成功大學 2020-12-1 Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density Liang;Chien-Lung;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Wang;Shan-Bo;Hung;Yun-Ching;Lin;Gao-Tian;Lin;Kwang-Lung
國立成功大學 2020- Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-mu m L/S Cu Redistribution Lines Liang;Chien-Lung;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Wang;Shan-Bo;Hung;Yun-Ching;Lin;Gao-Tian;Lin;Kwang-Lung

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