臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	Repositories
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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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	臺大學術典藏NTU Scholars

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Institution	Date	Title	Author
國立成功大學	2022-12	2022 Taiwan lipid guidelines for primary prevention	Huang;Po-Hsun;Lu;Ya-Wen;Tsai;Yi-Lin;Wu;Yen-Wen;Li;Hung-Yuan;Chang;Hsin-Yun;Wu;Chih-Hsing;Yang;Chih-Yu;Tarng;Der-Cherng;Huang;Chin-Chou;Ho;Li-Ting;Lin;Chao-Feng;Chien;Shih-Chieh;Wu;Yih-Jer;Yeh;Hung-I;Pan;Wen-Harn;Li;Yi-Heng
國立成功大學	2022-01	Epoxy Molding Compound Filler Clogging Simulation During Integrated Circuit Encapsulation Process	Chen;Bo-Heng;Hwang;Sheng-Jye;Chang;Yu-Yang;Yang;Yu-Shuo;Lee;Huei-Huang;Huang;Bing-Yuan;Hu;Ian;Chen;Dao-Long;Tarng;David;Hung;C, P.
國立成功大學	2021-05	Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu	Lin;Ting-Chun;Liang;Chien-Lung;Wang;Shan-Bo;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Lin;Kwang-Lung
國立成功大學	2020-12-1	Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density	Liang;Chien-Lung;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Wang;Shan-Bo;Hung;Yun-Ching;Lin;Gao-Tian;Lin;Kwang-Lung
國立成功大學	2020-	Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-mu m L/S Cu Redistribution Lines	Liang;Chien-Lung;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Wang;Shan-Bo;Hung;Yun-Ching;Lin;Gao-Tian;Lin;Kwang-Lung

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