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| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating
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Chen, Y. A.; Shih, P. S.; Chang, F. L.; Grafner, S. J.; Huang, J. H.; Huang, C. H.; Kao, C. R.; Lin, Y. S.; Hung, Y. C.; Kao, C. L.; Tarng, D. |
| 國立成功大學 |
2022 |
Novel Ga Assisted Low-temperature Bonding Technology for Fine-pitch Interconnects
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Wang, S.-B.;Hsu, A.-H.;Kao, C.-L.;Tarng, D.;Liang, C.-L.;Lin, K.-L. |
| 國立成功大學 |
2022 |
Development and Application of the Moisture-Dependent Viscoelastic Model of Polyimide in Hygro-Thermo-Mechanical Analysis of Fan-Out Interconnect
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Yang, C.-M.;Chiu, T.-C.;Yin, W.-J.;Chen, D.-L.;Kao, C.-L.;Tarng, D. |
| 國立成功大學 |
2021 |
A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect
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Liu, W.-T.;Yang, C.-M.;Chiu, T.-C.;Chen, D.-L.;Hsiao, C.-L.;Tarng, D. |
| 國立成功大學 |
2021 |
Establishment and Accuracy Assessment of Structural Equivalence of Fan-out Reconstitute Wafer for Asymmetric Warpage Prediction
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Chen, Chen C.-Y.;Lee, Y.-C.;Chen, Y.-S.;Chen, K.-S.;Chen, T.-Y.;Chen, D.-L.;Tarng, D. |
| 國立成功大學 |
2021 |
Development and Validation of a Semi-Analytical Model for Predicting Asymmetric Warpage of Fan-Out Reconstituting Packaging
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Lee, Y.-C.;Chen, Chen C.-Y.;Chen, Y.-S.;Chen, K.-S.;Chen, T.-Y.;Chen, D.-L.;Tarng, D. |
| 國立成功大學 |
2021 |
Development of semi-analytical formulation for asymmetric warpage prediction in fan-out reconstitution process
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Chen, K.-S.;Lee, Y.-C.;Chen, Chen C.-Y.;Chen, T.-Y.;Chen, D.-L.;Tarng, D. |
| 國立成功大學 |
2020 |
Electromigration Reliability of Advanced High-Density Fan-Out Packaging with Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines
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Liang, C.-L.;Lin, Y.-S.;Kao, C.-L.;Tarng, D.;Wang, S.-B.;Hung, Y.-C.;Lin, G.-T.;Lin, K.-L. |
| 國立成功大學 |
2020 |
A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package
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Chiu, T.-C.;Wu, J.-Y.;Liu, W.-T.;Liu, C.-W.;Chen, D.-L.;Shih, M.;Tarng, D. |
| 國立成功大學 |
2020 |
Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging
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Liang, C.-L.;Lin, Y.-S.;Kao, C.-L.;Tarng, D.;Wang, S.-B.;Hung, Y.-C.;Lin, K.-L. |
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