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Showing items 1-8 of 8  (1 Page(s) Totally)
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Institution Date Title Author
國立成功大學 2020-11 Performance of Cu-Ag Thin Films as Diffusion Barrier Layer Sung;Po-Hsien;Chen;Tei-Chen
國立成功大學 2020-06 Material Properties of Zr-Cu-Ni-Al Thin Films as Diffusion Barrier Layer Sung;Po-Hsien;Chen;Tei-Chen
國立成功大學 2019-05 Nanoscale Mechanical and Mechanically-Induced Electrical Properties of Silicon Nanowires Lin;Yen-Hung;Chen;Tei-Chen
國立成功大學 2019 Molecular dynamics simulation on mechanical behaviors of NixAl100-x nanowires under uniaxial compressive stress Hsu;Fu-Chieh;Chen;Tei-Chen
國立成功大學 2018-09 Electrothermal coupling analysis and experimental verification for wirebond devices Kao;Chin-Li;Chen;Tei-Chen
國立成功大學 2018-03 Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes Kao;Chin-Li;Chen;Tei-Chen
國立成功大學 2017-06 Determination of Azimuthal Anchoring Energies between the Rectangular-groove Surface and Nematic Liquid Crystal Layer by Using a Geometric Model Lin;Chin-Lung;Chen;Tei-Chen
國立成功大學 2017 SURFACE AZIMUTHAL ANCHORING ENERGY BETWEEN THE GRATING SURFACE AND NEMATIC LIQUID CRYSTAL LAYER STUDIED BY USING A GEOMETRIC MODEL Lin;Chin-Lung;Chen;Tei-Chen

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