臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立成功大學	2008-01	Simulations and experiments of three-dimensional paddle shift for IC packaging	Teng, Shiang-Yu; Hwang, Sheng-Jye
國立成功大學	2007-12	Predicting the process induced warpage of electronic packages using the P-V-T-C equation and the Taguchi method	Teng, Shiang-Yu; Hwang, Sheng-Jye
國立成功大學	2007-09	Simulations of process-induced warpage during IC encapsulation process	Teng, Shiang-Yu; Hwang, Sheng-Jye
國立成功大學	2007-05-21	IC封裝元件之翹曲與托盤偏移現象之研究	鄧湘榆; Teng, Shiang-Yu
國立成功大學	2007-05-21	IC封裝元件之翹曲與托盤偏移現象之研究	鄧湘榆; Teng, Shiang-Yu

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