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Institution	Date	Title	Author
國立交通大學	2020-02-02T23:55:32Z	Highly (111)-oriented Nanotwinned Cu for High Fatigue Resistance in fan-out wafer-level packaging	Li, Yu-Jin; Theng, Chih-Han; Tseng, I-Hsin; Chen, Chih; Lin, Benson; Chang, Chia-Cheng

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