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教育部委托研究计画 计画执行:国立台湾大学图书馆
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"tian tian"的相关文件
显示项目 1-4 / 4 (共1页) 1 每页显示[10|25|50]项目
臺大學術典藏 |
2020-01-06T03:11:42Z |
Utilization of original phosphogypsum for the preparation of foam concrete
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Tian, Tian; Yan, Yun; Hu, Zhihua; Xu, Yuanyuan; Chen, Yanping; Shi, Jian; YAN-PING CHEN |
國立交通大學 |
2019-04-03T06:41:32Z |
Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
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Chang, Yuan-Wei; Cheng, Yin; Helfen, Lukas; Xu, Feng; Tian, Tian; Scheel, Mario; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
國立交通大學 |
2018-08-21T05:56:50Z |
Study of Discrete Voids Formation in Flip-Chip Solder Joints due to Electromigration Using In-Situ 3D Laminography and Finite-Element Modeling
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Chang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
國立交通大學 |
2017-04-21T06:55:10Z |
Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling
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Chang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
显示项目 1-4 / 4 (共1页) 1 每页显示[10|25|50]项目
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