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机构 日期 题名 作者
國立成功大學 2021-02 Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing Hu;Siou-Han;Lin;Ting-Chun;Kao;Chin-Li;Huang;Fei-Ya;Tsai;Yi-Yun;Hsiao;Shih-Chieh;Kuo;Jui-Chao
國立成功大學 2020-11-17 Developed diamond wire sawing technique with high slicing ability for multicrystalline silicon wafers Wang;Ting-Chun;Yeh;Tsung-Han;Chu;Shao-Yu;Lee;Hsin-Ying;Lee;Ching-Ting
國立成功大學 2020-09 An Unusual Route for Intracardiac Cardioverter-Defibrillator Ventricular Lead Implantation in a Ventricular Tachycardia Patient with Tetralogy of Fallot Lee;Jen-Yuan;Tsai;Meng-Da;Chen;Ju-Yi;Huang;Ting-Chun;Lee;Po-Tseng
國立成功大學 2019 Elevated Platelet Galectin-3 and Rho-Associated Protein Kinase Activity Are Associated with Hemodialysis Arteriovenous Shunt Dysfunction among Subjects with Diabetes Mellitus Chen;Po-Wei;Hsu;Ling-Wei;Chang;Hsien-Yuan;Huang;Ting-Chun;Yu;Jia-Rong;Liao;Hsin-Yu;Lee;Cheng-Han;Liu;Ping-Yen
國立成功大學 2018-02 Investigated performance improvement of the micro-pressure sandblast treated multi-crystalline Si wafer sliced using diamond wire sawing Wang;Ting-Chun;Lee;Hsin-Ying;Lee;Ching-Ting;Cheng;Yu-Chin;Chen;Hung-Wei
國立成功大學 2017-09-19 Effects of anti-epileptic drugs on spreading depolarization-induced epileptiform activity in mouse hippocampal slices Lin;Ching-Huei;Hsu;Shih-Pin;Cheng;Ting-Chun;Huang;Chin-Wei;Chiang;Yao-Chang;Hsiao;I-Han;Lee;Ming-Hsueh;Shen;Mei-Lin;Wu;Chuan, Dong;Zhou;Ning
元培科技大學 2000 Bilayer Resists for DUV Lithography Fang; Mao-Ching ; Tai; Ming-Chia; Chang; Jui-Fa; Lin; Tzu-Yu; Liu; Ting-Chun

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