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Taiwan Academic Institutional Repository >
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"tong ho ming"
Showing items 1-19 of 19 (1 Page(s) Totally)
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| 國立交通大學 |
2016-03-28T00:05:44Z |
Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications
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Chang, Chih-Wei; Huang, Po-Tsang; Chou, Lei-Chun; Wu, Shang-Lin; Lee, Shih-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Chiou, Jin-Chern; Hwang, Wei; Lee, Yen-Chi; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming |
| 國立交通大學 |
2015-12-02T03:00:57Z |
Integrated Microprobe Array and CMOS MEMS by TSV Technology for Bio- Signal Recording Application
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Chou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Wu, Shang-Lin; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2015-12-02T03:00:54Z |
A TSV-Based Heterogeneous Integrated Neural-Signal Recording Device with Microprobe Array
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Chou, Lei-Chun; Lee, Shih-Wei; Cheng, Chuan-An; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2015-12-02T03:00:50Z |
Energy-Efficient Low-Noise 16-Channel Analog-Front-End Circuit for Bio-potential Acquisition
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Wu, Shang-Lin; Huang, Po-Tsang; Huang, Teng-Chieh; Chen, Kuan-Neng; Chiou, Jin-Chern; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chuang, Ching-Te; Hwang, Wei |
| 國立交通大學 |
2015-07-21T11:20:52Z |
2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications
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Huang, Po-Tsang; Wu, Shang-Lin; Huang, Yu-Chieh; Chou, Lei-Chun; Huang, Teng-Chieh; Wang, Tang-Hsuan; Lin, Yu-Rou; Cheng, Chuan-An; Shen, Wen-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Chiou, Jin-Chern; Hwang, Wei; Tong, Ho-Ming |
| 國立交通大學 |
2015-07-21T08:31:30Z |
2.5D Heterogeneously Integrated Bio-Sensing Microsystem for Multi-Channel Neural-Sensing Applications
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Huang, Po-Tsang; Chou, Lei-Chun; Huang, Teng-Chieh; Wu, Shang-Lin; Wang, Tang-Shuan; Lin, Yu-Rou; Cheng, Chuan-An; Shen, Wen-Wei; Chen, Kuan-Neng; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Chen, Kuo-Hua; Chiu, Chi-Tsung; Cheng, Ming-Hsiang; Lin, Yueh-Lung; Tong, Ho-Ming |
| 國立交通大學 |
2015-07-21T08:31:17Z |
Energy-Efficient Configurable Discrete Wavelet Transform for Neural Sensing Applications
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Wang, Tang-Hsuan; Huang, Po-Tsang; Chen, Kuan-Neng; Chiou, Jin-Chem; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chuang, Ching-Te; Hwang, Wei |
| 國立交通大學 |
2015-07-21T08:29:00Z |
A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications
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Chang, Chih-Wei; Chou, Lei-Chun; Huang, Po-Tsang; Wu, Shang-Lin; Lee, Shih-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Hwang, Wei; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chiou, Jin-Chern |
| 國立交通大學 |
2014-12-08T15:35:47Z |
Area-Power-Efficient 11-Bit SAR ADC with Delay-Line Enhanced Tuning for Neural Sensing Applications
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Huang, Teng-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Chen, Kuan-Neng; Chiou, Jin-Chern; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chuang, Ching-Te; Hwang, Wei |
| 國立交通大學 |
2014-12-08T15:35:46Z |
Low Temperature (< 180 degrees C) Wafer-level and Chip-level In-to-Cu and Cu-to-Cu Bonding for 3D Integration
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Chien, Yu-San; Huang, Yan-Pin; Tzeng, Ruoh-Ning; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:46Z |
Multi-Layer Adaptive Power Management Architecture for TSV 3DIC Applications
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Chang, Ming-Hung; Hsieh, Wei-Chih; Wu, Pei-Chen; Chuang, Ching-Te; Chen, Kuan-Neng; Wang, Chen-Chao; Ting, Chun-Yen; Chen, Kua-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Hwang, Wei |
| 國立交通大學 |
2014-12-08T15:35:44Z |
Near-/Sub-V-th Process, Voltage, and Temperature (PVT) Sensors with Dynamic Voltage Selection
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Chang, Ming-Hung; Lin, Shang-Yuan; Wu, Pei-Chen; Zakoretska, Olesya; Chuang, Ching-Te; Chen, Kuan-Neng; Wang, Chen-Chao; Chen, Kua-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Hwang, Wei |
| 國立交通大學 |
2014-12-08T15:35:19Z |
Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration
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Chien, Yu-San; Huang, Yan-Pin; Tzeng, Ruoh-Ning; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:16Z |
Low Temperature (< 180 degrees C) Bonding for 3D Integration
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Huang, Yan-Pin; Tzeng, Ruoh-Ning; Chien, Yu-San; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chuang, Ching-Te; Hwang, Wei; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:05Z |
A TSV-Based Bio-Signal Package With mu-Probe Array
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Chou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:33:26Z |
Novel Cu-to-Cu Bonding With Ti Passivation at 180 degrees C in 3-D Integration
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Huang, Yan-Pin; Chien, Yu-San; Tzeng, Ruoh-Ning; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chiu, Chi-Tsung; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:30:49Z |
Investigation of ICP Parameters for Smooth TSVs and Following Cu Plating Process in 3D Integration
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Chiang, Cheng-Hao; Hu, Yu-Chen; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:30:49Z |
Micro-masking Removal of TSV and Cavity during ICP Etching Using Parameter Control in 3D and MEMS Integrations
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Hu, Yu-Chen; Chiang, Cheng-Hao; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立成功大學 |
2014 |
A study of chip-last embedded flip-chip package
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Chao, Shin-Hua; Tong, Ho-Ming; Hung, Chih-Pin; Lai, Yishao; Liu, Colin; Hsieh, Emma; Luh, Ding-Bang |
Showing items 1-19 of 19 (1 Page(s) Totally)
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