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Institution Date Title Author
國立交通大學 2020-03-02T03:23:28Z Adhesion Properties of Electroplating Process Between Polyimide and Metal Layer for Polymer/Metal Hybrid Bonding Lu, Cheng-Hsien; Yang, Yi-Lun; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng
國立交通大學 2019-08-02T02:15:29Z Asymmetric Wafer-Level Polyimide and Cu/Sn Hybrid Bonding for 3-D Heterogeneous Integration Lu, Cheng-Hsien; Jhu, Shu-Yan; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng
國立交通大學 2019-04-02T05:59:00Z Adhesion and Material Properties Between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3-D Integration Lu, Cheng-Hsien; Kho, Yi-Tung; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng
國立臺灣大學 2011 Programmable one-pot synthesis of tumor-associated carbohydrate antigens Lewis X dimer and KH-1 epitopes Tsai, Bin-Ling; Han, Jeng-Liang; Ren, Chien-Tai; Wu, Chung-Yi; Wong, Chi-Huey
國立臺灣大學 2009 合成路易士X二聚體與KH-1抗原分子 蔡秉霖; Tsai, Bin-Ling

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