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机构 日期 题名 作者
臺大學術典藏 2022-03-24T03:26:59Z Comparison of the PCB serum levels among mother-child pairs in areas of Eastern Japan and Central Taiwan Yuan T.-H.; Eguchi A.; Tai C.-J.; Tsai C.-H.; Chien J.-W.; CHANG-CHUAN CHAN; Mori C.
臺大學術典藏 2022-03-22T08:30:22Z Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:22Z A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:21Z A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:20Z Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:28:51Z Development of an immersive SLAM-based VR system for teleoperation of a mobile manipulator in an unknown environment Kuo C.-Y;Huang C.-C;Tsai C.-H;Shi Y.-S;Smith S.; Kuo C.-Y; Huang C.-C; Tsai C.-H; Shi Y.-S; Smith S.; SHANA SMITH
臺大學術典藏 2022-03-22T08:28:51Z Development of an immersive SLAM-based VR system for teleoperation of a mobile manipulator in an unknown environment Kuo C.-Y;Huang C.-C;Tsai C.-H;Shi Y.-S;Smith S.; Kuo C.-Y; Huang C.-C; Tsai C.-H; Shi Y.-S; Smith S.; SHANA SMITH
臺大學術典藏 2022-03-22T08:27:24Z A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:27:23Z Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:26:03Z Development of an immersive SLAM-based VR system for teleoperation of a mobile manipulator in an unknown environment Kuo C.-Y;Huang C.-C;Tsai C.-H;Shi Y.-S;Smith S.; Kuo C.-Y; Huang C.-C; Tsai C.-H; Shi Y.-S; Smith S.; SHANA SMITH

显示项目 91-100 / 1146 (共115页)
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每页显示[10|25|50]项目