臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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機構	日期	題名	作者
臺大學術典藏	2022-03-24T03:26:59Z	Comparison of the PCB serum levels among mother-child pairs in areas of Eastern Japan and Central Taiwan	Yuan T.-H.; Eguchi A.; Tai C.-J.; Tsai C.-H.; Chien J.-W.; CHANG-CHUAN CHAN; Mori C.
臺大學術典藏	2022-03-22T08:30:22Z	Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment	Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:30:22Z	A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn	Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:30:21Z	A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn	Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:30:20Z	Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment	Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:28:51Z	Development of an immersive SLAM-based VR system for teleoperation of a mobile manipulator in an unknown environment	Kuo C.-Y;Huang C.-C;Tsai C.-H;Shi Y.-S;Smith S.; Kuo C.-Y; Huang C.-C; Tsai C.-H; Shi Y.-S; Smith S.; SHANA SMITH
臺大學術典藏	2022-03-22T08:28:51Z	Development of an immersive SLAM-based VR system for teleoperation of a mobile manipulator in an unknown environment	Kuo C.-Y;Huang C.-C;Tsai C.-H;Shi Y.-S;Smith S.; Kuo C.-Y; Huang C.-C; Tsai C.-H; Shi Y.-S; Smith S.; SHANA SMITH
臺大學術典藏	2022-03-22T08:27:24Z	A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn	Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:27:23Z	Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment	Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:26:03Z	Development of an immersive SLAM-based VR system for teleoperation of a mobile manipulator in an unknown environment	Kuo C.-Y;Huang C.-C;Tsai C.-H;Shi Y.-S;Smith S.; Kuo C.-Y; Huang C.-C; Tsai C.-H; Shi Y.-S; Smith S.; SHANA SMITH

顯示項目 91-100 / 1146 (共115頁)
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