|
English
|
正體中文
|
简体中文
|
2832427
|
|
???header.visitor??? :
33775106
???header.onlineuser??? :
1466
???header.sponsordeclaration???
|
|
|
|
???tair.name??? >
???browser.page.title.author???
|
"tsai c z"???jsp.browse.items-by-author.description???
Showing items 1-5 of 5 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 臺大學術典藏 |
2020-02-26T01:33:36Z |
Bone defect healing enhanced by ultrasound stimulation: An in vitro tissue culture model
|
Feng-Huei LinSun, J.-S.;Tsuang, Y.-H.;Lin, F.H.;Liu, H.-C.;Tsai, C.-Z.;Chang, W.H.-S.; Sun, J.-S.; Tsuang, Y.-H.; Lin, F.H.; Liu, H.-C.; Tsai, C.-Z.; Chang, W.H.-S.; FENG-HUEI LIN |
| 臺大學術典藏 |
2020-02-07T03:43:57Z |
Bone defect healing enhanced by ultrasound stimulation: An in vitro tissue culture model
|
Jui-Sheng Sun;Tsuang Y.-H.;Lin F.H.;Liu H.-C.;Tsai C.-Z.;Chang W.H.-S.; JUI-SHENG SUN; Tsuang Y.-H.; Lin F.H.; Liu H.-C.; Tsai C.-Z.; Chang W.H.-S. |
| 國立臺灣大學 |
2005-06 |
Mechanical behavior of flip chip packages under thermal loading
|
Chen, Shoulung; Tsai, C.Z.; Kao, Nicholas; Wu, Enboa |
| 國立臺灣大學 |
2004-06 |
How to improve chip strength to avoid die cracking in a package
|
Chen, Shoulung; Shih, I.G.; Chen, Y.N.; Tsai, C.Z.; Lin, J.W.; Wu, Enboa |
| 國立臺灣大學 |
2002-05 |
Influence of grinding process on semiconductor chip strength
|
Wu, Enboa; Shih, I.G.; Chen, Y.N.; Chen, S.C.; Tsai, C.Z.; Shao, C.A. |
Showing items 1-5 of 5 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
