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"tsai chin hao"
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| 臺大學術典藏 |
2022-03-22T15:04:52Z |
Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices
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Tsai, Chin Hao; Huang, Wei Chen; Kao, Chengheng Robert |
| 臺大學術典藏 |
2021-11-21T23:18:57Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
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Tsai, Chin Hao; Huang, Wei Chen; Chew, Ly May; Schmitt, Wolfgang; Li, Jiahui; Nishikawa, Hiroshi; Kao, C. R. |
| 臺大學術典藏 |
2021-09-21T23:19:32Z |
A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn
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Tsai, Chin Hao; Lin, Sze Yin; Lee, Pei Tzu; C. ROBERT KAO |
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