| 臺大學術典藏 |
2020-07-20T05:28:09Z |
Retropalatal M?ller grade is associated with the severity of obstructive sleep apnea in non-obese Asian patients: Retropalatal M?ller grade and OSA in non-obese
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Wu M.-J. ;Ho C.-Y. ;Tsai H.-H. ;Huang H.-M. ;Pei-Lin Lee ;Tan C.-T.; Wu M.-J.; Ho C.-Y.; Tsai H.-H.; Huang H.-M.; PEI-LIN LEE; Tan C.-T. |
| 臺大學術典藏 |
2020-07-03T03:17:15Z |
The graded effect of hyperhomocysteinemia on the severity and extent of coronary atherosclerosis
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Lee Y.-T.; Chao C.-L.;Tsai H.-H.;Lee C.-M.;Hsu S.-M.;Jau-Tsuen Kao;Chien K.-L.;Sung F.-C.;Lee Y.-T.; Chao C.-L.; Tsai H.-H.; Lee C.-M.; Hsu S.-M.; JAU-TSUEN KAO; Chien K.-L.; Sung F.-C. |
| 臺大學術典藏 |
2020-06-11T06:39:46Z |
P-N Double Quantum Well Resonant Interband Tunneling Diode with Peak-to-Valley Current Ratio of 144 at Room Temperature
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Tsai, H.H.;Su, Y.K.;Wang, R.L.;Lin, H.H.;Lee, T.L.; Tsai, H.H.; Su, Y.K.; Wang, R.L.; Lin, H.H.; Lee, T.L.; HAO-HSIUNG LIN |
| 臺大學術典藏 |
2020-05-26T09:27:04Z |
MEK inhibitors reverse resistance in epidermal growth factor receptor mutation lung cancer cells with acquired resistance to gefitinib
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Huang M.-H;Lee J.-H;Chang Y.-J;Tsai H.-H;Lin Y.-L;Lin A.M.Y;Chih-Hsin Yang; Huang M.-H; Lee J.-H; Chang Y.-J; Tsai H.-H; Lin Y.-L; Lin A.M.Y; CHIH-HSIN YANG |
| 臺大學術典藏 |
2020-05-12T02:53:09Z |
Thermal stability of grain structure and material properties in an annealing-twinned Ag-8Au-3Pd alloy wire
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Chuang, T.-H.; Wang, H.-C.; Tsai, C.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Effect of annealing twins on electromigration in Ag-8Au-3Pd bonding wires
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Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Formation and growth of intermetallics in an annealing-twinned Ag-8Au-3Pd wire bonding package during reliability tests
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Chuang, T.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Effects of annealing twins on the grain growth and mechanical properties of Ag-8Au-3Pd bonding wires
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Chuang, T.-H.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packaging
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Tsai, H.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing
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Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Tsai, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Surface reconstruction of an annealing twinned Ag-8Au-3Pd alloy wire under current stressing
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Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lin, H.-J.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
High performance Ag-Pd alloy wires for high frequency IC packages
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Tsai, H.-H.; Chuang, T.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Lin, H.-J.; Chang, C.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Applications of Ag-Alloy stud bump for IC and LED packages
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Tsai, H.-H.; Tsai, C.-H.; Lee, J.-D.; Chang, D.; Shih, Y.-T.; Chen, C.-H.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Thermal stability of grain structure and material properties in an annealing twinned Ag-4Pd alloy wire
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Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Shiue, Y.-Y.; Shieu, F.-S.; Huang, Y.-L.; Hsu, P.-C.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:05Z |
Low temperature bonding of Pd/Ni assembly for hydrogen purifier
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Lin, Y.-C.; Chuang, C.-H.; Tsai, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:04Z |
Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages
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Tsai, C.-H.; Chuang, C.-H.; Tsai, H.-H.; Lee, J.-D.; Chang, D.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:02Z |
Effect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding Wires
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Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:01Z |
Au-induced improvements in the grain stability and mechanical properties of Ag-based alloy wires under electrical current stressing
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Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:01Z |
Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires
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Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-04-21T03:52:09Z |
Electronic structure and lattice dynamics of LixCoO2 single crystals
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Liu, H. L.; Ou-Yang, T. Y.; Tsai, H. H.; Lin, P. A.; Jeng, H. T.; Shu, G. J.; Chou, F. C. |
| 臺大學術典藏 |
2020-04-16T02:34:46Z |
Robust dermatological wound image segmentation in clinical photos
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Tai, H.-C.; Cheng, N.-C.; FEI-PEI LAI; Lai, F.; Chen, C.C.-P.; Chang, C.; Ho, T.-W.; Wu, J.-M.; Tsai, H.-H. |
| 臺大學術典藏 |
2020-03-24T02:57:17Z |
Cavitation-induced traumatic cerebral contusion and intracerebral hemorrhage in the rat brain by using an off-the-shelf clinical shockwave device
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Chen W.-S.; Lin C.-F.; Tsai H.-H.; Yeh C.-S.; Lan C.; Kung Y.; Hsu Y.-H.; Lai D.-M.; ABEL PO-HAO HUANG; Abel Po-Hao Huang;Lai D.-M.;Hsu Y.-H.;Kung Y.;Lan C.;Yeh C.-S.;Tsai H.-H.;Lin C.-F.;Chen W.-S. |
| 臺大學術典藏 |
2020-03-09T04:24:06Z |
Robust dermatological wound image segmentation in clinical photos
|
Chang C.; Ho T.-W.; Wu J.-M.; Tsai H.-H.; Chen C.C.-P.; Lai F.; Tai H.-C.; NAI-CHEN CHENG |
| 臺大學術典藏 |
2020-03-06T03:42:52Z |
The effects of perceived identity and justice experiences with an ADR institution on managers' decision preferences
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Tsai M.-H.; SHU-CHENG CHI; Tsai H.-H.; Chi S.-C. |
| 臺大學術典藏 |
2020-03-05T06:05:35Z |
Correlation of Cerebral Microbleed Distribution to Amyloid Burden in Patients with Primary Intracerebral Hemorrhage
|
Tsai H.-H.; LI-KAI TSAI; Chen Y.-F.; Tang S.-C.; Lee B.-C.; Yen R.-F.; Jeng J.-S. |
