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"tsai ms"的相关文件
显示项目 36-60 / 100 (共4页)
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| 國立交通大學 |
2017-04-21T06:55:33Z |
Chemical mechanical polishing for selective CVD-W
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Wang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC |
| 國家衛生研究院 |
2017-03 |
Perfluoroalkyl substances and thyroid hormones in cord blood
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Tsai, MS;Lin, CC;Chen, MH;Hsieh, WS;Chen, PC |
| 國家衛生研究院 |
2016-02-12 |
Changes of immunogenic profiles between a single dose and one booster influenza vaccination in hemodialysis patients - an 18-week, open-label trial
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Chang, YT;Wang, JR;Lin, MT;Wu, CJ;Tsai, MS;Chiang-Lin, WC;Shih, TE;Kuo, TH;Song, EJ;Sung, JM |
| 中國醫藥大學 |
2015-09 |
Cholelithiasis and Nephrolithiasis in HIV-Positive Patients in the Era of Combination Antiretroviral Therapy
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(Lin, KY);(Liao, SH);(Liu, WC);(Cheng, A);(Lin, SW);(Chang, SY);(Tsai, MS);(Kuo, CH);(Wu, MR);(Wang, HP)*;洪健清(Chien-Ching Hung)*;(Chang, SC) |
| 中國醫藥大學 |
2015-05 |
Optimal Dose of Benzathine Penicillin G for the Treatment of Early Syphilis in HIV-Infected Patients in the Era of Combination Antiretroviral Therapy
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(Yang, CJ);(Chen, YH);(Tsai, MS);洪健清(Chien-Ching Hung)* |
| 國立交通大學 |
2014-12-08T15:48:51Z |
Conduction mechanism and temperature-dependent current-voltage in (Ba, Sr)TiO3 thin films
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Tsai, MS; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:47:24Z |
Effect of bottom electrodes on dielectric relaxation and defect analysis of (Ba0.47Sr0.53)TiO3 thin film capacitors
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Tsai, MS; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:46:54Z |
Effect of bottom electrode materials and annealing treatments on the electrical characteristics of Ba0.47Sr0.53TiO3 film capacitors
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Tsai, MS; Sun, SC; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:46:14Z |
Effect of bottom electrode materials on the electrical and reliability characteristics of (Ba, Sr)TiO3 capacitors
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Tsai, MS; Sun, SC; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:46:13Z |
Effect of oxygen to argon ratio on defects and electrical conductivities in Ba0.47Sr0.53TiO3 thin-film capacitors
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Tsai, MS; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:46:08Z |
Nitric acid-based slurry with citric acid as an inhibitor for copper chemical mechanical polishing
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Hu, TC; Chiu, SY; Dai, BT; Tsai, MS; Tung, IC; Feng, MS |
| 國立交通大學 |
2014-12-08T15:46:05Z |
The novel precleaning treatment for selective tungsten chemical vapor deposition
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Chang, TC; Mor, YS; Liu, PT; Sze, SM; Yang, YL; Tsai, MS; Chang, CY |
| 國立交通大學 |
2014-12-08T15:45:36Z |
Effect of bottom electrodes on resistance degradation and breakdown of (Ba, Sr)TiO3 thin films
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Tsai, MS; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:45:19Z |
Retardation in the chemical-mechanical polish of the boron-doped polysilicon and silicon
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Yang, WL; Cheng, CY; Tsai, MS; Liu, DG; Shieh, MS |
| 國立交通大學 |
2014-12-08T15:45:16Z |
Dielectric relaxation and defect analysis of Ta2O5 thin films
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Ezhilvalavan, S; Tsai, MS; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:45:06Z |
Novel cleaning solutions for polysilicon film post chemical mechanical polishing
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Pan, TM; Lei, TF; Chen, CC; Chao, TS; Liaw, MC; Yang, WL; Tsai, MS; Lu, CP; Chang, WH |
| 國立交通大學 |
2014-12-08T15:44:55Z |
The effect of oxygen-to-argon ratio on the electrical and reliability characteristics of sputtered Sr0.8Bi2.5Ta1.2Nb0.9O9+x thin films
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Tsai, MS; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:44:42Z |
Improvement of post-chemical mechanical planarization characteristics on organic low k methylsilsesquioxane as intermetal dielectric
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Liu, PT; Chang, TC; Huang, MC; Yang, YL; Mor, YS; Tsai, MS; Chung, H; Hou, J; Sze, SM |
| 國立交通大學 |
2014-12-08T15:43:55Z |
Elimination of dielectric degradation for chemical-mechanical planarization of low-k hydrogen silisesquioxane
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Chang, TC; Liu, PT; Tsai, TM; Yeh, FS; Tseng, TY; Tsai, MS; Chen, BC; Yang, YL; Sze, SM |
| 國立交通大學 |
2014-12-08T15:43:42Z |
Highly reliable chemical-mechanical polishing process for organic low-k methylsilsesquioxane
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Liu, PT; Chang, TC; Huang, MC; Tsai, MS; Sze, SM |
| 國立交通大學 |
2014-12-08T15:43:39Z |
Selective copper metallization by electrochemical contact displacement with amorphous silicon film
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Lee, YP; Tsai, MS; Hu, TC; Dai, BT; Feng, MS |
| 國立交通大學 |
2014-12-08T15:42:47Z |
Electrochemical behavior of copper chemical mechanical polishing in KIO3 slurry
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Hsu, JW; Chiu, SY; Tsai, MS; Dai, BT; Feng, MS; Shih, HC |
| 國立交通大學 |
2014-12-08T15:42:45Z |
The removal selectivity of titanium and aluminum in chemical mechanical planarization
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Hsu, JW; Chiu, SY; Wang, YL; Dai, BT; Tsai, MS; Feng, MS; Shih, HC |
| 國立交通大學 |
2014-12-08T15:42:21Z |
Expression, characterization, and purification of recombinant porcine lactoferrin in Pichia pastoris
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Wang, SH; Yang, TS; Lin, SM; Tsai, MS; Wu, SC; Mao, SJT |
| 國立交通大學 |
2014-12-08T15:40:06Z |
The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer
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Chiu, SY; Wang, YL; Liu, CP; Lan, JK; Ay, C; Feng, MS; Tsai, MS; Dai, BT |
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