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"tsai ms"的相关文件
显示项目 61-70 / 100 (共10页)
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| 國立交通大學 |
2014-12-08T15:39:17Z |
The removal of airborne molecular contamination in cleanroom using PTFE and chemical filters
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Yeh, CF; Hsiao, CW; Lin, SJ; Hsieh, CM; Kusumi, T; Aomi, H; Kaneko, H; Dai, BT; Tsai, MS |
| 國立交通大學 |
2014-12-08T15:37:19Z |
Post-Cu CMP cleaning for colloidal silica abrasive removal
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Chen, PL; Chen, JH; Tsai, MS; Dai, BT; Yeh, CF |
| 國立交通大學 |
2014-12-08T15:36:01Z |
Pattern effect optimized with non-native surface passivation in copper abrasive-free polishing
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Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS |
| 國立交通大學 |
2014-12-08T15:27:11Z |
A study on electrochemical metrologies for evaluating the removal selectivity of AlCMP
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Chiu, SY; Hsu, JW; Tung, IC; Shih, HC; Feng, MS; Tsai, MS; Dai, BT |
| 國立交通大學 |
2014-12-08T15:27:05Z |
Study on chemical-mechanical polishing of low dielectric constant polyimide thin films
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Tai, YL; Tsai, MS; Tung, IC; Dai, BT; Feng, MS |
| 國立交通大學 |
2014-12-08T15:26:34Z |
Impact of airborne molecular contamination to nano-device performance
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Yeh, CF; Hsiao, CW; Lin, SJ; Xie, ZM; Kusumi, T; Aomi, H; Kaneko, H; Da, BT; Tsai, MS |
| 國立交通大學 |
2014-12-08T15:17:43Z |
Effect of surface passivation removal on planarization efficiency in Cu abrasive-free polishing
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Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS |
| 國立交通大學 |
2014-12-08T15:17:35Z |
Study on pressure-independent Cu removal in Cu abrasive-free polishing
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Fang, JY; Huang, PW; Tsai, MS; Dai, BT; Wu, YS; Feng, MS |
| 國立交通大學 |
2014-12-08T15:01:58Z |
Chemical-mechanical polishing and material characteristics of plasma-enhanced chemically vapor deposited fluorinated oxide thin films
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Tseng, WT; Hsieh, YT; Lin, CF; Tsai, MS; Feng, MS |
| 國立交通大學 |
2014-12-08T15:01:24Z |
Effect of oxygen to argon ratio on properties of (Ba,Sr)TiO3 thin films prepared by radio-frequency magnetron sputtering
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Tsai, MS; Sun, SC; Tseng, TY |
显示项目 61-70 / 100 (共10页)
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