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教育部委託研究計畫      計畫執行:國立臺灣大學圖書館
 
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機構 日期 題名 作者
國立交通大學 2014-12-08T15:45:06Z Novel cleaning solutions for polysilicon film post chemical mechanical polishing Pan, TM; Lei, TF; Chen, CC; Chao, TS; Liaw, MC; Yang, WL; Tsai, MS; Lu, CP; Chang, WH
國立交通大學 2014-12-08T15:44:55Z The effect of oxygen-to-argon ratio on the electrical and reliability characteristics of sputtered Sr0.8Bi2.5Ta1.2Nb0.9O9+x thin films Tsai, MS; Tseng, TY
國立交通大學 2014-12-08T15:44:42Z Improvement of post-chemical mechanical planarization characteristics on organic low k methylsilsesquioxane as intermetal dielectric Liu, PT; Chang, TC; Huang, MC; Yang, YL; Mor, YS; Tsai, MS; Chung, H; Hou, J; Sze, SM
國立交通大學 2014-12-08T15:43:55Z Elimination of dielectric degradation for chemical-mechanical planarization of low-k hydrogen silisesquioxane Chang, TC; Liu, PT; Tsai, TM; Yeh, FS; Tseng, TY; Tsai, MS; Chen, BC; Yang, YL; Sze, SM
國立交通大學 2014-12-08T15:43:42Z Highly reliable chemical-mechanical polishing process for organic low-k methylsilsesquioxane Liu, PT; Chang, TC; Huang, MC; Tsai, MS; Sze, SM
國立交通大學 2014-12-08T15:43:39Z Selective copper metallization by electrochemical contact displacement with amorphous silicon film Lee, YP; Tsai, MS; Hu, TC; Dai, BT; Feng, MS
國立交通大學 2014-12-08T15:42:47Z Electrochemical behavior of copper chemical mechanical polishing in KIO3 slurry Hsu, JW; Chiu, SY; Tsai, MS; Dai, BT; Feng, MS; Shih, HC
國立交通大學 2014-12-08T15:42:45Z The removal selectivity of titanium and aluminum in chemical mechanical planarization Hsu, JW; Chiu, SY; Wang, YL; Dai, BT; Tsai, MS; Feng, MS; Shih, HC
國立交通大學 2014-12-08T15:42:21Z Expression, characterization, and purification of recombinant porcine lactoferrin in Pichia pastoris Wang, SH; Yang, TS; Lin, SM; Tsai, MS; Wu, SC; Mao, SJT
國立交通大學 2014-12-08T15:40:06Z The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer Chiu, SY; Wang, YL; Liu, CP; Lan, JK; Ay, C; Feng, MS; Tsai, MS; Dai, BT

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