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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立交通大學 2014-12-08T15:39:17Z The removal of airborne molecular contamination in cleanroom using PTFE and chemical filters Yeh, CF; Hsiao, CW; Lin, SJ; Hsieh, CM; Kusumi, T; Aomi, H; Kaneko, H; Dai, BT; Tsai, MS
國立交通大學 2014-12-08T15:37:19Z Post-Cu CMP cleaning for colloidal silica abrasive removal Chen, PL; Chen, JH; Tsai, MS; Dai, BT; Yeh, CF
國立交通大學 2014-12-08T15:36:01Z Pattern effect optimized with non-native surface passivation in copper abrasive-free polishing Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS
國立交通大學 2014-12-08T15:27:11Z A study on electrochemical metrologies for evaluating the removal selectivity of AlCMP Chiu, SY; Hsu, JW; Tung, IC; Shih, HC; Feng, MS; Tsai, MS; Dai, BT
國立交通大學 2014-12-08T15:27:05Z Study on chemical-mechanical polishing of low dielectric constant polyimide thin films Tai, YL; Tsai, MS; Tung, IC; Dai, BT; Feng, MS
國立交通大學 2014-12-08T15:26:34Z Impact of airborne molecular contamination to nano-device performance Yeh, CF; Hsiao, CW; Lin, SJ; Xie, ZM; Kusumi, T; Aomi, H; Kaneko, H; Da, BT; Tsai, MS
國立交通大學 2014-12-08T15:17:43Z Effect of surface passivation removal on planarization efficiency in Cu abrasive-free polishing Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS
國立交通大學 2014-12-08T15:17:35Z Study on pressure-independent Cu removal in Cu abrasive-free polishing Fang, JY; Huang, PW; Tsai, MS; Dai, BT; Wu, YS; Feng, MS
國立交通大學 2014-12-08T15:01:58Z Chemical-mechanical polishing and material characteristics of plasma-enhanced chemically vapor deposited fluorinated oxide thin films Tseng, WT; Hsieh, YT; Lin, CF; Tsai, MS; Feng, MS
國立交通大學 2014-12-08T15:01:24Z Effect of oxygen to argon ratio on properties of (Ba,Sr)TiO3 thin films prepared by radio-frequency magnetron sputtering Tsai, MS; Sun, SC; Tseng, TY

Showing items 61-70 of 100  (10 Page(s) Totally)
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