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Showing items 1-4 of 4 (1 Page(s) Totally)
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| 臺大學術典藏 |
2020-02-26T01:37:14Z |
Potocki-Lupski syndrome with teratologic dislocation of the hip: A case report
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Kuo, C.-C.; Chang, C.-C.; Hsu, H.-C.; Lu, T.-W.; Tsai, N.-Y.; TUNG-WU LU |
| 臺大學術典藏 |
2020-01-13T08:23:06Z |
Thermal stress aware design for stacking IC with through glass via
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Chien, J.-H.; Yu, H.; Lung, C.-L.; Chang, H.-C.; Tsai, N.-Y.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 臺大學術典藏 |
2020-01-13T08:23:06Z |
Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures
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Chien, J.-H.; Yu, H.; Tsai, N.-Y.; Lung, C.-L.; Hsu, C.-C.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 臺大學術典藏 |
2018-09-10T09:18:50Z |
Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures
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Chien, J.-H.; Yu, H.; Tsai, N.-Y.; Lung, C.-L.; Hsu, C.-C.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
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