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"tsai teng chun"的相关文件
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| 國立成功大學 |
2011 |
Effects of Post-CMP Cleaning on Time Dependent Dielectric Breakdown and Electro-Migration in Porous Low-k/Cu Interconnects
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Hsu, Chia-Lin; Perng, Dung-Ching; Lin, Wen-Chin; Lu, Kuan-Ting; Tsai, Teng-Chun; Huang, Climbing; Wu, J. Y. |
| 淡江大學 |
1998-05-05 |
Process and apparatus for manufacturing aluminum laminally filled plastic pellets for shielding electromagnetic interference
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Chuang, Tung-han; 林清彬; Lin, Ching-bin; Tsai, Teng-chun; Chang, Jiin-chyuan |
| 淡江大學 |
1996/11/01 |
Process and apparatus for manufacturing aluminum laminally filled plastic pellets for shielding electromagnetic interference
|
Chuang, Tung-Han;Lin, Ching-Bin;Tsai, Teng-Chun;Chang, Jiin-Chyuan |
显示项目 1-3 / 3 (共1页)
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