臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
元智大學	Sep-18	Interfacial Microstructure and Mechanical Reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) Reactive System: P Content Effects	Ying-Syuan Wu; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Mar-18	High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes	Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo
元智大學	Jan-19	Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy	Yu-Hsuan Huang; Wan-Zhen Hsieh; Pei-Tzu Lee; Ying-Syuan Wu; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Jan-19	Significant improvement of the thermal stability and electrochemical corrosion resistance of the Au/Pd surface finish through catalytic modification	Yu-Hsuan Huang; Shu-Ping Yang; Pei-Tzu Lee; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Jan-15	Interfacial Reaction and Mechanical Characterization of Sn-Ag-Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition	Cheng-En Ho; Wan-Zhen Hsieh; Cheng-Hsien Yang; Ting-Chun Yeh; Tsai-Tung Kuo
元智大學	Feb-19	Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad	Ying-Syuan Wu; Pei-Tzu Lee; Wan-Zhen Hsieh; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Aug-16	Interfacial Microstructures and Mechanical Properties of Molten Sn Reacting with Ni-xP Films	Wan-Zhen Hsieh; Md. Arifur Rahman; Tsung-Hsun Yang; Tsai-Tung Kuo; Cheng-En Ho
元智大學	2018-11-16	Flexible Ni(P) Microstructure and Its Working Mechanism	Wei-Ling Chou; Wan-Zhen Hsieh; Cheng-Yu Lee; Cheng-Sam Peng; Tsai-Tung Kuo; Cheng-En Ho
元智大學	2018-10-23	Toward A Better Understanding of Working Mechanism of Flexible Ni(P)	Wei-Ling Chou; Wan-Zhen Hsieh; Cheng-Yu Lee; Cheng-Sam Peng; Tsai-Tung Kuo; Cheng-En Ho
元智大學	2017-10-25	Significant Improvement of Electrochemical Corrosion and Thermal Stability of EPIG (Au/Pd) Surface Finish by Depositing A Au Nanolayer	Yu-Hsuan Huang; Yu-Xuan Wang; Pei-Tzu Lee; Shu-Ping Yang; Tsai-Tung Kuo; Cheng-En Ho
元智大學	2016-10-26	Reliability Testing of Au/Pd/Cu and Au/Pd(P)/Cu Surface Finishes at High Temperature Storage	Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Tsai-Tung Kuo
元智大學	2014	鈀金雙金屬層應用於銅銲墊之無鉛銲接可靠度評估	郭蔡同; Tsai-Tung Kuo

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