| 朝陽科技大學 |
2022-09-30 |
物聯網安全機制之軟硬體整合設計與系統實作
|
蔡子玄; Tsai, Tzu-Hsuan |
| 國立成功大學 |
2022-06-16 |
可重複使用之包裝空箱庫存規劃模型之研究-以觸控面板製造廠為例
|
蔡姿璇; Tsai, Tzu-Hsuan |
| 朝陽科技大學 |
2022-01-03 |
Automatic Key Update Mechanism for Lightweight M2M Communication and Enhancement of IoT Security: A Case Study of CoAP using Libcoap Library
|
蔡文宗; Tsai, Wen-Chung; Tsai, Tzu-Hsuan; Wang, Te-Jen; Chiang, Mao-Lun |
| 朝陽科技大學 |
2020-08-14 |
An Automatic Key-update Mechanism for M2M Communication and IoT Security Enhancement
|
Tsai, Wen-Chung; Tsai, Tzu-Hsuan; Xiao, Guang-Hao; Wang, Te-Jen; Lian, Yu-Ruei; Huang, Song-Hao; 蔡文宗 |
| 淡江大學 |
2009-01 |
Metal Removal from Silicon Sawing Waste using the Electrokinetic Method
|
Tsai, Tzu-hsuan; Huang, J. H. |
| 淡江大學 |
2007-12 |
Effect of Organic Acids on Copper Chemical Mechanical Polishing
|
Wu, Yung-fu; Tsai, Tzu-hsuan |
| 淡江大學 |
2007-11-26 |
Electropolishing Mechanisms ofCopper-Plated Wafer in Phosphoric Acid
|
Tsai, Tzu-hsuan; Wu, Y. F. |
| 淡江大學 |
2007-05-11 |
Electrochemical Planarization of Copper-Plated Wafer in Phosphoric Acid
|
Tsai, Tzu-hsuan; Wu, Y. F. |
| 淡江大學 |
2007-04 |
電化學技術在半導體銅製程中的應用
|
Tsai, Tzu-hsuan; Yen, S. C. |
| 淡江大學 |
2006-06 |
Wet Etching Mechanisms of ITO Films in Oxalic acid
|
Tsai, Tzu-hsuan; Wu, Y. F. |
| 淡江大學 |
2006-06 |
Effects of Nonionic Surfactants on Performance of Copper Chemical Mechanical Polishing
|
Tsai, Tzu-hsuan; Wu, Y. F. |
| 淡江大學 |
2005-05 |
Glycolic Acid in Hydrogen Peroxide-Based Slurry for Enhancing Copper Chemical Mechanical Polishing
|
Tsai, Tzu-hsuan; Wu,Y. F.; Yen, S. C. |
| 國立臺灣大學 |
2005 |
Glycolic acid in hydrogen peroxide-based slurry for enhancing copper chemical mechanical polishing
|
Tsai, Tzu-Hsuan; Wu, Yung-Fu; Yen, Shi-Chern |
| 淡江大學 |
2004-12-03 |
Apparatus of Ion Sensitive Thin Film Transistor and Method of Manufacturing of the Same
|
蔡子萱; Tsai, Tzu-hsuan; Wu, Yung-fu |
| 淡江大學 |
2003-05 |
A study of copper chemical mechanical polishing in urea–hydrogen peroxide slurry by electrochemical impedance spectroscopy
|
Tsai, Tzu-hsuan; Wu, Yung-fu; Yen, Shi-chern |
| 淡江大學 |
2003-04-15 |
Localized Corrosion Effects and Modifications of Acidic and Alkaline Slurries on Copper Chemical Mechanical Polishing
|
Tsai, Tzu-hsuan; Yen, Shi-chern |
| 國立臺灣大學 |
2003 |
Localized corrosion effects and modifications of acidic and alkaline slurries on copper chemical mechanical polishing
|
Tsai, Tzu-Hsuan; Yen, Shi-Chern |
| 國立臺灣大學 |
2003 |
A study of copper chemical mechanical polishing in urea–hydrogen peroxide slurry by electrochemical impedance spectroscopy
|
Tsai, Tzu-Hsuan; Wu, Yung-Fu; Yen, Shi-Chern |
