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Institution Date Title Author
臺大學術典藏 2020-05-04T07:48:26Z Use 3D Convolutional Neural Network to Inspect Solder Ball Defects. CHIOU-SHANN FUH; Fuh, Chiou-Shann; Lin, Bing-Jhang; Tsan, Ting-Chen; Tung, Tzu-Chia; Lee, You-Hsien
臺大學術典藏 2020-05-04T07:48:26Z Solder Ball 3D Reconstruction with X-Ray Images Using Filtered Back Projection. CHIOU-SHANN FUH; Fuh, Chiou-Shann; Tung, Tzu-Chia; Tsan, Ting-Chen; Lin, Bing-Jhang; Lee, You-Hsien

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