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Showing items 1-2 of 2 (1 Page(s) Totally) 1 View [10|25|50] records per page
臺大學術典藏 |
2020-05-04T07:48:26Z |
Use 3D Convolutional Neural Network to Inspect Solder Ball Defects.
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CHIOU-SHANN FUH; Fuh, Chiou-Shann; Lin, Bing-Jhang; Tsan, Ting-Chen; Tung, Tzu-Chia; Lee, You-Hsien |
臺大學術典藏 |
2020-05-04T07:48:26Z |
Solder Ball 3D Reconstruction with X-Ray Images Using Filtered Back Projection.
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CHIOU-SHANN FUH; Fuh, Chiou-Shann; Tung, Tzu-Chia; Tsan, Ting-Chen; Lin, Bing-Jhang; Lee, You-Hsien |
Showing items 1-2 of 2 (1 Page(s) Totally) 1 View [10|25|50] records per page
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