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Showing items 1-10 of 11 (2 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:29:12Z |
How tantalum proceeds phase change on tantalum nitride underlayer with sequential Ar plasma treatment
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Tsao, Jung-Chih; Liu, Chuan-Pu; Fang, Hsin-Chiao; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:07:06Z |
Microstructure and Formation of Copper Oxide in the Cu Electro-Polishing Process
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Kung, Te-Ming; Huang, Michael Rong-Shie; Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2012-07-03 |
低阻值薄擴散阻障層應用於先進銅製程之研究
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曹榮志; Tsao, Jung-Chih |
| 國立成功大學 |
2012-06-30 |
低阻值薄擴散阻障層應用於先進銅製程之研究
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曹榮志; Tsao, Jung-Chih |
| 國立成功大學 |
2009-02 |
Study of Nitrogen Diffusion Profile of Low Resistivity Diffusion Barrier by Resputtering Technology
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Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kei-Wei |
| 國立成功大學 |
2008-05 |
Direct alpha Ta formation on TaN by resputtering for low resistive diffusion barriers
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Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kei-Wei |
| 國立成功大學 |
2008-05 |
The integration solution of copper barrier deposition for nanometer interconnect process
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Chen, Kei-Wei; Wang, Ying-Lang; Tsao, Jung-Chih; Lo, Kuang-Yao |
| 國立成功大學 |
2008-02 |
Interface integration defect of copper and low-K materials beyond nano-scale copper damascene process
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Chen, Kel-Wei; Wang, Ying-Lang; Tsao, Jung-Chih; Juang, Yungder; Lee, Feng-Yi |
| 國立成功大學 |
2008-02 |
Mechanism of over-etching defects during Ta/TaN barrier resputtering in micro-trench for Cu metallization
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Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kel-Wel; Lo, Kuang-Yao |
| 國立成功大學 |
2008-02 |
Controlling Ta phase in Ta/TaN bilayer by surface pre-treatment on TaN
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Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Wang, Yu-Sheng; Chen, Ke-Wei |
Showing items 1-10 of 11 (2 Page(s) Totally)
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