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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立交通大學 2014-12-08T15:29:12Z How tantalum proceeds phase change on tantalum nitride underlayer with sequential Ar plasma treatment Tsao, Jung-Chih; Liu, Chuan-Pu; Fang, Hsin-Chiao; Wang, Ying-Lang
國立交通大學 2014-12-08T15:07:06Z Microstructure and Formation of Copper Oxide in the Cu Electro-Polishing Process Kung, Te-Ming; Huang, Michael Rong-Shie; Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang
國立成功大學 2012-07-03 低阻值薄擴散阻障層應用於先進銅製程之研究 曹榮志; Tsao, Jung-Chih
國立成功大學 2012-06-30 低阻值薄擴散阻障層應用於先進銅製程之研究 曹榮志; Tsao, Jung-Chih
國立成功大學 2009-02 Study of Nitrogen Diffusion Profile of Low Resistivity Diffusion Barrier by Resputtering Technology Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kei-Wei
國立成功大學 2008-05 Direct alpha Ta formation on TaN by resputtering for low resistive diffusion barriers Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kei-Wei
國立成功大學 2008-05 The integration solution of copper barrier deposition for nanometer interconnect process Chen, Kei-Wei; Wang, Ying-Lang; Tsao, Jung-Chih; Lo, Kuang-Yao
國立成功大學 2008-02 Interface integration defect of copper and low-K materials beyond nano-scale copper damascene process Chen, Kel-Wei; Wang, Ying-Lang; Tsao, Jung-Chih; Juang, Yungder; Lee, Feng-Yi
國立成功大學 2008-02 Mechanism of over-etching defects during Ta/TaN barrier resputtering in micro-trench for Cu metallization Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kel-Wel; Lo, Kuang-Yao
國立成功大學 2008-02 Controlling Ta phase in Ta/TaN bilayer by surface pre-treatment on TaN Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Wang, Yu-Sheng; Chen, Ke-Wei
國立成功大學 2004-11 Effects of wetting ability of plating electrolyte on Cu seed layer for electroplated copper film Liu, Chi-Wen; Tsao, Jung-Chih; Tsai, Ming-Shih; Wang, Ying-Lang

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