| 臺大學術典藏 |
2022-03-22T08:30:54Z |
Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina
|
Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:52Z |
Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina
|
Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:52Z |
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
|
Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:51Z |
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
|
Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:52Z |
Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina
|
Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
|
Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-11-08T01:52:17Z |
Composite diagnostic criteria are problematic for linking potentially distinct populations: the case of frailty
|
Chao Y.-S.; Wu C.-J.; HSING-CHIEN WU; Hsu H.-T.; Tsao L.-C.; Cheng Y.-P.; Lai Y.-C.; Chen W.-C. |
| 臺大學術典藏 |
2021-11-08T01:52:17Z |
Opportunities and Challenges From Leading Trends in a Biomonitoring Project: Canadian Health Measures Survey 2007�V2017
|
Chao Y.-S.; Wu C.-J.; HSING-CHIEN WU; Hsu H.-T.; Tsao L.-C.; Cheng Y.-P.; Lai Y.-C.; Chen W.-C. |
| 臺大學術典藏 |
2021-11-08T01:52:17Z |
Simulation study to demonstrate biases created by diagnostic criteria of mental illnesses: Major depressive episodes, dysthymia, and manic episodes
|
Chao Y.-S.; Lin K.-F.; Wu C.-J.; HSING-CHIEN WU; Hsu H.-T.; Tsao L.-C.; Cheng Y.-P.; Lai Y.-C.; Chen W.-C. |
| 臺大學術典藏 |
2021-11-08T01:52:16Z |
Using syndrome mining with the Health and Retirement Study to identify the deadliest and least deadly frailty syndromes
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Chao Y.-S.; Wu C.-J.; HSING-CHIEN WU; Hsu H.-T.; Tsao L.-C.; Cheng Y.-P.; Lai Y.-C.; Chen W.-C. |
| 臺大學術典藏 |
2020-05-12T02:53:21Z |
Effects of microstructures on corrosion and stress corrosion behaviors of an Al-12.1 at.% Zn alloy
|
Yeh, M.S.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements
|
Su, T.L.; Wang, S.S.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; Yeh, M.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Corrosion behavior of Al-Si-Cu-(Sn, Zn) brazing filler metals
|
Wang, S.S.; Cheng, M.D.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint under thermal aging
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TUNG-HAN CHUANG; Tsao, L.C.; Huang, Y.T.; Chuang, T.H. |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Brazeability of the 6061-T6 aluminum alloy with Al-Si-20Cu-based filler metals
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Tsao, L.C.; Tsai, T.C.; Wu, C.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages
|
Chuang, T.H.; Chang, S.Y.; Tsao, L.C.; Weng, W.P.; Wu, H.M.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Evaluation of the formability of plastic/Zn22Al/plastic sandwiched structures by gas blowing
|
Tsao, L.C.; Su, T.L.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
|
Su, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate
|
Su, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Brazeability of a 3003 aluminum alloy with Al-Si-Cu-based filler metals
|
TUNG-HAN CHUANG; Chuang, T.H.; Tsao, C.W.; Cheng, M.D.; Weng, W.P.; Tsao, L.C. |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Effects of zinc additions on the microstructure and melting temperatures of Al-Si-Cu filler metals
|
Tsao, L.C.; Chiang, M.J.; Lin, W.H.; Cheng, M.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:16Z |
Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy
|
Chang, S.-Y.; Wang, S.-S.; Tsao, L.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Active soldering of ZnS-SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal
|
Chang, S.Y.; Chuang, T.H.; Tsao, L.C.; Yang, C.L.; Yang, Z.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads
|
Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Joining 6061 aluminum alloy with Al-Si-Cu filler metals
|
Chang, S.Y.; Tsao, L.C.; Li, T.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
