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"tsao l c"的相关文件
显示项目 21-45 / 81 (共4页)
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| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Effects of zinc additions on the microstructure and melting temperatures of Al-Si-Cu filler metals
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Tsao, L.C.; Chiang, M.J.; Lin, W.H.; Cheng, M.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:16Z |
Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy
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Chang, S.-Y.; Wang, S.-S.; Tsao, L.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Active soldering of ZnS-SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal
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Chang, S.Y.; Chuang, T.H.; Tsao, L.C.; Yang, C.L.; Yang, Z.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads
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Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Joining 6061 aluminum alloy with Al-Si-Cu filler metals
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Chang, S.Y.; Tsao, L.C.; Li, T.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:09Z |
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
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Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-02-26T01:36:50Z |
Self-aligned stylus with high sphericity for micro coordinate measurement
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Tsai, Y.-C.;Chang, D.-R.;Tsao, L.-C.;Wu, M.-D.;Shih, P.-J.;Shih, W.-P.;Po-Jen Shih; Tsai, Y.-C.; Chang, D.-R.; Tsao, L.-C.; Wu, M.-D.; Shih, P.-J.; Shih, W.-P.; PO-JEN SHIH |
| 臺大學術典藏 |
2020-01-13T08:25:10Z |
An integrated flexible temperature and tactile sensing array using PI-copper films
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YAO-JOE YANG; Fan, K.-C.; Chang, S.-H.; Chang, F.-Y.; Shih, W.-P.; Yang, S.-A.; Tsao, L.-C.; Chang, W.-Y.; Yang, Y.-J.; Cheng, M.-Y. |
| 臺大學術典藏 |
2020-01-13T08:25:06Z |
Flexible temperature sensor array based on a Graphite-Polydimethylsiloxane composite
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Shih, W.-P.; Tsao, L.-C.; Lee, C.-W.; Cheng, M.-Y.; Chang, C.; Yang, Y.-J.; Fan, K.-C.; YAO-JOE YANG |
| 臺大學術典藏 |
2018-09-10T06:58:58Z |
Porous nylon with electro-active dopants as flexible sensors and actuators
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Yu, S.L.;Chang, Duo-Ru;Tsao, L.C.;Shih, Wen-Pin;Chang, Pei-Zen; Yu, S.-L. and Chang, D.-R. and Tsao, L.-C. and Shih, W.-P. and Chang, P.-Z.; WEN-PIN SHIH; Yu, S.L.; Chang, Duo-Ru; Tsao, L.C.; Shih, Wen-Pin; Chang, Pei-Zen |
| 臺大學術典藏 |
2018-06-28T22:23:24Z |
Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging
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ChuangTH; Chang, S.Y.; Chung, Chien-Han; Tsao, L.C.; Chuang, T.H.; Chuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y. |
| 臺大學術典藏 |
2018-06-28T22:11:27Z |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
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Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH |
| 國立成功大學 |
2013-12 |
Formation of ultrafine structure in as cast Ti7CuXSn alloys
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Tsao, L. C.; Wu, R. W.; Wu, M. W.; Huang, C. H.; Chen, R. S. |
| 國立成功大學 |
2013-09 |
Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads
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Tsao, L. C.; Wu, R. W.; Cheng, Te-Hsien; Fan, Kuo-Huan; Chen, R. S. |
| 國立成功大學 |
2012-05-30 |
Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder
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Tsao, L. C.; Huang, C. H.; Chung, C. H.; Chen, R. S. |
| 國立臺灣大學 |
2012 |
Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging
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Chuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y. |
| 國立成功大學 |
2011-08 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
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Wu, R. W.; Tsao, L. C.; Chang, S. Y.; Jain, C. C.; Chen, R. S. |
| 國立臺灣大學 |
2011 |
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
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Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C. |
| 國立臺灣大學 |
2011 |
Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder
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Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C. |
| 國立臺灣大學 |
2011 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
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Wu, R.W.; Tsao, L.C.; Chang, S.Y.; Jain, C.C.; Chen, R.S. |
| 臺大學術典藏 |
2011 |
Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder
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Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C.; ChuangTH; Chuang, T.H.; Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C. |
| 國立臺灣大學 |
2008-08 |
A comparison of polymer composites for development of flexible sensor array
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Shih, W.-P.; Lee, C.-L.; Lee, C.-W.; Tsao, L.-C.; Yang, Y.-J.; Fan, K.-C. |
| 國立臺灣大學 |
2008-07 |
Fabrication and characterization od electro-active polymer for flexible tactile sensing array
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Tsao, L.C.; Chang, D.R.; Shih, W.P.; Fan, K.C. |
| 國立臺灣科技大學 |
2008 |
An Integrated Flexible Temperature and Tactile Sensing Array using PI-copper films
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Yang, Y.J. ; Cheng, M.Y. ; Chang, W.Y. ; Tsao, L.C. ; Yang, S.A. ; Shih, W.P. ; Chang, F.Y. ; Chang, S. H. ; Fan, K.C. |
| 國立臺灣科技大學 |
2008 |
On applying fair queuing discipline to schedule requests at access gateway for downlink differential QoS
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Tsao, S.-C.;Lai, Y.-C.;Tsao, L.-C.;Lin, Y.-D. |
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